Inventor
WEIGAND PETER
DE20 patents
⚠️ This page may combine multiple inventors who share the name “WEIGAND PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
11 patentsUS6046503AApr 4, 2000
Metalization system having an enhanced thermal conductivity
SIEMENS AG54 citations96
US5851899ADec 22, 1998
Gapfill and planarization process for shallow trench isolation
SIEMENS AG87 citations96
US5937541AAug 17, 1999
Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
SIEMENS AG60 citations95
US5854126ADec 29, 1998
Method for forming metallization in semiconductor devices with a self-planarizing material
SIEMENS AG30 citations92
US6492282B1Dec 10, 2002
Integrated circuits and manufacturing methods
SIEMENS AG10 citations73
US5992046ANov 30, 1999
Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
SIEMENS AG13 citations73
US5963837AOct 5, 1999
Method of planarizing the semiconductor structure
SIEMENS AG8 citations73
US5926716AJul 20, 1999
Method for forming a structure
SIEMENS AG13 citations73
US5899736AMay 4, 1999
Techniques for forming electrically blowable fuses on an integrated circuit
SIEMENS AG11 citations73
US5977635ANov 2, 1999
Multi-level conductive structure including low capacitance material
SIEMENS AG4 citations62
US6015988AJan 18, 2000
Microstructure and methods for fabricating such structure
SIEMENS AG0 citations52