Inventor
KAO JEN-CHIEH
TW23 patents
⚠️ This page may combine multiple inventors who share the name “KAO JEN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
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22 patentsUS7002257B2Feb 21, 2006
Optical component package and packaging including an optical component horizontally attached to a substrate
ADVANCED SEMICONDUCTOR ENG19 citations92
US6838762B2Jan 4, 2005
Water-level package with bump ring
ADVANCED SEMICONDUCTOR ENG24 citations92
US6822324B2Nov 23, 2004
Wafer-level package with a cavity and fabricating method thereof
ADVANCED SEMICONDUCTOR ENG48 citations92
US6809852B2Oct 26, 2004
Microsystem package structure
ADVANCED SEMICONDUCTOR ENG49 citations92
US6768207B2Jul 27, 2004
Multichip wafer-level package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG44 citations92
US6693364B2Feb 17, 2004
Optical integrated circuit element package and process for making the same
ADVANCED SEMICONDUCTOR ENG23 citations92
US10580713B2Mar 3, 2020
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG6 citations84
US11410899B2Aug 9, 2022
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations73
US7614888B2Nov 10, 2009
Flip chip package process
ADVANCED SEMICONDUCTOR ENG7 citations72
US11037891B2Jun 15, 2021
Device package
ADVANCED SEMICONDUCTOR ENG3 citations71
US10381300B2Aug 13, 2019
Semiconductor device package including filling mold via
ADVANCED SEMICONDUCTOR ENG4 citations71
US11462455B2Oct 4, 2022
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations67
US7247267B2Jul 24, 2007
Mold and method of molding semiconductor devices
ADVANCED SEMICONDUCTOR ENG6 citations63
US12087652B2Sep 10, 2024
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11862544B2Jan 2, 2024
Electronic assembly
ADVANCED SEMICONDUCTOR ENG0 citations62
US10991656B2Apr 27, 2021
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US10950530B2Mar 16, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US12119312B2Oct 15, 2024
Device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US11705412B2Jul 18, 2023
Device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US12572170B2Mar 10, 2026
Electronic device with removable electronic component modules
ADVANCED SEMICONDUCTOR ENG0 citations58
US10332849B2Jun 25, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations48
US10074622B2Sep 11, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations48