Inventor
YEE PAK HONG
SG12 patents
⚠️ This page may combine multiple inventors who share the name “YEE PAK HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
5 patentsUS7138711B2Nov 21, 2006
Intrinsic thermal enhancement for FBGA package
MICRON TECHNOLOGY INC31 citations92
US7030640B2Apr 18, 2006
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
MICRON TECHNOLOGY INC15 citations84
US7521794B2Apr 21, 2009
Intrinsic thermal enhancement for FBGA package
MICRON TECHNOLOGY INC5 citations73
US7459346B2Dec 2, 2008
Intrinsic thermal enhancement for FBGA package
MICRON TECHNOLOGY INC8 citations73
US7285971B2Oct 23, 2007
Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
MICRON TECHNOLOGY INC5 citations62
TEXAS INSTRUMENTS INC
3 patentsUS6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
AVAGO TECH ECBU IP SG PTE LTD
3 patentsUS7514666B2Apr 7, 2009
Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted
AVAGO TECH ECBU IP SG PTE LTD20 citations92
US7842957B2Nov 30, 2010
Optical transceiver with reduced height
AVAGO TECH ECBU IP SG PTE LTD25 citations89
US7495204B2Feb 24, 2009
Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly
AVAGO TECH ECBU IP SG PTE LTD3 citations62