P

Inventor

LEE JIA-SHENG

TW19 patents
⚠️ This page may combine multiple inventors who share the name “LEE JIA-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

18 patents
US6272736B1Aug 14, 2001

Method for forming a thin-film resistor

UNITED MICROELECTRONICS CORP88 citations97
US6207560B1Mar 27, 2001

Method for manufacturing thin-film resistor

UNITED MICROELECTRONICS CORP41 citations92
US6071763AJun 6, 2000

Method of fabricating layered integrated circuit

UNITED MICROELECTRONICS CORP24 citations92
US6225183B1May 1, 2001

Method of fabricating a thin-film resistor having stable resistance

UNITED MICROELECTRONICS CORP17 citations83
US6124615ASep 26, 2000

Stacked semiconductor structure for high integration of an integrated circuit with junction devices

UNITED MICROELECTRONICS CORP16 citations83
US6524925B1Feb 25, 2003

Method of forming a thin-film resistor in a semiconductor wafer

UNITED MICROELECTRONICS CORP7 citations73
US6316325B1Nov 13, 2001

Method for fabricating a thin film resistor

UNITED MICROELECTRONICS CORP7 citations73
US6228735B1May 8, 2001

Method of fabricating thin-film transistor

UNITED MICROELECTRONICS CORP10 citations73
US6121667ASep 19, 2000

Photo diode

UNITED MICROELECTRONICS CORP10 citations73
US6117789ASep 12, 2000

Method of manufacturing thin film resistor layer

UNITED MICROELECTRONICS CORP9 citations73
US6013545AJan 11, 2000

Method of manufacturing high-voltage metal-oxide-semiconductor device

UNITED MICROELECTRONICS CORP8 citations73
US5891770AApr 6, 1999

Method for fabricating a high bias metal oxide semiconductor device

UNITED MICROELECTRONICS CORP9 citations73
US6489882B2Dec 3, 2002

Thin-film resistor

UNITED MICROELECTRONICS CORP3 citations62
US6207521B1Mar 27, 2001

Thin-film resistor employed in a semiconductor wafer and its method formation

UNITED MICROELECTRONICS CORP2 citations62
US6156618ADec 5, 2000

Method for fabricating thin film resistor

UNITED MICROELECTRONICS CORP3 citations62
US6110764AAug 29, 2000

Method of manufacturing an assembly with different types of high-voltage metal-oxide-semiconductor devices

UNITED MICROELECTRONICS CORP2 citations62
US6103589AAug 15, 2000

High-voltage device substrate structure and method of fabrication

UNITED MICROELECTRONICS CORP2 citations62
US6037229AMar 14, 2000

High-voltage device substrate structure and method of fabrication

UNITED MICROELECTRONICS CORP2 citations62

TAIWAN SEMICONDUCTOR MFG

1 patent