Inventor
DYCKMAN WARREN D
US9 patents
⚠️ This page may combine multiple inventors who share the name “DYCKMAN WARREN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS7617403B2Nov 10, 2009
Method and apparatus for controlling heat generation in a multi-core processor
IBM37 citations92
US7584369B2Sep 1, 2009
Method and apparatus for monitoring and controlling heat generation in a multi-core processor
IBM28 citations92
US6657864B1Dec 2, 2003
High density thermal solution for direct attach modules
IBM52 citations92
US6680530B1Jan 20, 2004
Multi-step transmission line for multilayer packaging
IBM33 citations91
US7721119B2May 18, 2010
System and method to optimize multi-core microprocessor performance using voltage offsets
IBM20 citations90
US7271681B2Sep 18, 2007
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards
IBM12 citations82
US7085143B1Aug 1, 2006
In-module current source
IBM13 citations82
US6583498B1Jun 24, 2003
Integrated circuit packaging with tapered striplines of constant impedance
IBM2 citations57