P

Inventor

KURASHIMA NOBUYUKI

JP40 patents
⚠️ This page may combine multiple inventors who share the name “KURASHIMA NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

19 patents
US10704838B2Jul 7, 2020

Loop heat pipe

SHINKO ELECTRIC IND CO8 citations84
US10352626B2Jul 16, 2019

Heat pipe

SHINKO ELECTRIC IND CO6 citations84
US9137900B2Sep 15, 2015

Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate

SHINKO ELECTRIC IND CO15 citations84
US9036362B2May 19, 2015

Electronic component incorporated substrate

SHINKO ELECTRIC IND CO11 citations84
US7105423B2Sep 12, 2006

Method of manufacturing semiconductor device

SHINKO ELECTRIC IND CO12 citations84
US11592240B2Feb 28, 2023

Loop-type heat pipe with vapor moving path in liquid pipe

SHINKO ELECTRIC IND CO2 citations73
US10524388B2Dec 31, 2019

Loop heat pipe and electronic device

SHINKO ELECTRIC IND CO2 citations73
US10497640B2Dec 3, 2019

Heat pipe

SHINKO ELECTRIC IND CO2 citations73
US10408546B2Sep 10, 2019

Loop heat pipe

SHINKO ELECTRIC IND CO5 citations73
US11384993B2Jul 12, 2022

Heat pipe

SHINKO ELECTRIC IND CO1 citations63
US8987919B2Mar 24, 2015

Built-in electronic component substrate and method for manufacturing the substrate

SHINKO ELECTRIC IND CO2 citations63
US7827681B2Nov 9, 2010

Method of manufacturing electronic component integrated substrate

SHINKO ELECTRIC IND CO2 citations63
US7498259B2Mar 3, 2009

Through electrode and method for forming the same

SHINKO ELECTRIC IND CO5 citations63
US10962301B2Mar 30, 2021

Loop heat pipe

SHINKO ELECTRIC IND CO1 citations62
US10712098B2Jul 14, 2020

Loop heat pipe and method of manufacturing loop heat pipe

SHINKO ELECTRIC IND CO1 citations62
US11333443B2May 17, 2022

Loop heat pipe

SHINKO ELECTRIC IND CO1 citations61
US10495386B2Dec 3, 2019

Loop heat pipe and electronic device

SHINKO ELECTRIC IND CO1 citations60
US11143461B2Oct 12, 2021

Flat loop heat pipe

SHINKO ELECTRIC IND CO0 citations52
US9059088B2Jun 16, 2015

Electronic component built-in substrate

SHINKO ELECTRIC IND CO0 citations36

TOSHIBA KK

16 patents
US6858539B2Feb 22, 2005

Post-CMP treating liquid and method for manufacturing semiconductor device

TOSHIBA KK24 citations93
US7042099B2May 9, 2006

Semiconductor device containing a dummy wire

TOSHIBA KK35 citations92
US6935928B2Aug 30, 2005

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

TOSHIBA KK24 citations92
US7307344B2Dec 11, 2007

Semiconductor device including a discontinuous film and method for manufacturing the same

TOSHIBA KK17 citations84
US7842191B2Nov 30, 2010

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device

TOSHIBA KK7 citations74
US6995090B2Feb 7, 2006

Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device

TOSHIBA KK6 citations74
US6790769B2Sep 14, 2004

CMP slurry and method of manufacturing semiconductor device

TOSHIBA KK6 citations74
US7833431B2Nov 16, 2010

Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device

TOSHIBA KK3 citations63
US7655559B2Feb 2, 2010

Post-CMP treating liquid and manufacturing method of semiconductor device using the same

TOSHIBA KK5 citations63
US7521350B2Apr 21, 2009

Manufacturing method of a semiconductor device

TOSHIBA KK4 citations63
US6945854B2Sep 20, 2005

Semiconductor device fabrication method and apparatus

TOSHIBA KK3 citations63
US6737363B2May 18, 2004

Method of manufacturing semiconductor device

TOSHIBA KK3 citations63
US7951717B2May 31, 2011

Post-CMP treating liquid and manufacturing method of semiconductor device using the same

TOSHIBA KK0 citations52
US7825028B2Nov 2, 2010

Method of manufacturing semiconductor device

TOSHIBA KK0 citations52
US7494931B2Feb 24, 2009

Method for fabricating semiconductor device and polishing method

TOSHIBA KK1 citations52
US7198729B2Apr 3, 2007

CMP slurry and method of manufacturing semiconductor device

TOSHIBA KK0 citations52

MINAMIHABA GAKU

2 patents

JSR CORP

1 patent

KURASHIMA NOBUYUKI

1 patent

TANAKA KOICHI

1 patent