Inventor
CUI JI
US35 patents
⚠️ This page may combine multiple inventors who share the name “CUI JI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11772228B2Oct 3, 2023
Chemical mechanical polishing apparatus including a multi-zone platen
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12545810B2Feb 10, 2026
Magnetic polishing slurry and method for polishing a workpiece
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12359090B2Jul 15, 2025
Composition and method for polishing and integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068169B2Aug 20, 2024
Semiconductor processing tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11718812B2Aug 8, 2023
Post-CMP cleaning composition for germanium-containing substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11450565B2Sep 20, 2022
Ion implant process for defect elimination in metal layer planarization
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12297375B2May 13, 2025
Slurry composition and method for polishing and integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12131944B2Oct 29, 2024
Slurry composition, semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12002684B2Jun 4, 2024
Methods for chemical mechanical polishing and forming interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11658065B2May 23, 2023
Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11508585B2Nov 22, 2022
Methods for chemical mechanical polishing and forming interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
CABOT MICROELECTRONICS CORP
8 patentsUS10920107B2Feb 16, 2021
Self-stopping polishing composition and method for bulk oxide planarization
CABOT MICROELECTRONICS CORP2 citations69
US10619076B2Apr 14, 2020
Self-stopping polishing composition and method for bulk oxide planarization
CABOT MICROELECTRONICS CORP2 citations69
US11043151B2Jun 22, 2021
Surface treated abrasive particles for tungsten buff applications
CABOT MICROELECTRONICS CORP1 citations59
US10619075B2Apr 14, 2020
Self-stopping polishing composition and method for bulk oxide planarization
CABOT MICROELECTRONICS CORP1 citations59
US11597854B2Mar 7, 2023
Method to increase barrier film removal rate in bulk tungsten slurry
CABOT MICROELECTRONICS CORP0 citations57
US10639766B2May 5, 2020
Methods and compositions for processing dielectric substrate
CABOT MICROELECTRONICS CORP0 citations51
US10029345B2Jul 24, 2018
Methods and compositions for processing dielectric substrate
CABOT MICROELECTRONICS CORP0 citations51
US10522341B2Dec 31, 2019
Composition and method for removing residue from chemical-mechanical planarization substrate
CABOT MICROELECTRONICS CORP0 citations50
NALCO CO
5 patentsUS6867318B1Mar 15, 2005
Composition for coating of aluminum
NALCO CO31 citations92
US8372999B2Feb 12, 2013
Organically modified silica and use thereof
NALCO CO7 citations82
US7862862B2Jan 4, 2011
Water dispersible silanes as corrosion-protection coatings and paint primers for metal pretreatment
NALCO CO3 citations62
US8029752B2Oct 4, 2011
Approach in controlling DSP scale in bayer process
NALCO CO2 citations59
US8501010B2Aug 6, 2013
Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer process
NALCO CO0 citations52
CUI JI
4 patentsUS8282834B2Oct 9, 2012
Di- and mono-alkoxysilane functionalized polymers and their application in the Bayer process
CUI JI7 citations83
US7911029B2Mar 22, 2011
Multilayer electronic devices for imbedded capacitor
CUI JI12 citations83
US8455673B2Jun 4, 2013
Water dispersible silanes
CUI JI2 citations61
US8623766B2Jan 7, 2014
Composition and method for polishing aluminum semiconductor substrates
CUI JI2 citations60