Inventor

HUANG FU-TANG

TW23 patents

⚠️ This page may combine multiple inventors who share the name “HUANG FU-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG FU-TANG

SILICONWARE PRECISION INDUSTRIES CO LTD

Semiconductor structure and method of fabricating the same

Substrate structure with filling material formed in concave portion

Electronic package and method for fabricating the same

Package substrate and structure

Semiconductor device and fabrication method thereof and semiconductor structure

Method of fabricating semiconductor package having semiconductor element

Fabrication method of semiconductor structure

Substrate construction and electronic package including the same

Fabrication method of semiconductor structure

Semiconductor package and fabrication method thereof

Electronic package structure and method for fabricating the same

Method for fabricating package structure

Method of manufacturing substrate structure with filling material formed in concave portion

Fabrication method of electronic package having embedded package block

Semiconductor package and method of fabricating the same

Method for fabricating electronic package

Semiconductor package and fabrication method thereof

Semiconductor device and fabrication method thereof

Packaging substrate and package structure

Package stack structure and method for manufacturing the same

Electronic package and method for fabricating the same

HUANG FU-TANG

High power receptacle connector

YEH CHUN-WEI

Package structure and fabrication method thereof