Inventor

MOON CHANG-YOUL

KR47 patents

⚠️ This page may combine multiple inventors who share the name “MOON CHANG-YOUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOON CHANG-YOUL

SAMSUNG ELECTRONICS CO LTD

Lighting device

Semiconductor wafer pre-aligning apparatus

Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same

Wafer level package for surface acoustic wave device and fabrication method thereof

LED package, manufacturing method thereof, and LED array module using the same

Wafer level packaging cap and fabrication method thereof

High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor

Gyro-sensor comprising a plurality of component units, and fabricating method thereof

Multi stack packaging chip and method of manufacturing the same

Methods of transferring semiconductor elements and manufacturing semiconductor devices

Methods of transferring graphene and manufacturing device using the same

Graphene device manufacturing apparatus and graphene device manufacturing method using the apparatus

Ink jet printer head

Apparatus for jetting ink using a magnet and a plurality of coils installed on a plate to generate a magnetic field

Method of manufacturing an image drum

Toner adsorption image forming apparatus

LED package and fabrication method thereof

Light emitting device package having a transparent cover

Ink-jet printer head

Graphene devices and methods of manufacturing the same

Graphene transferring methods, device manufacturing method using the same, and substrate structures including graphene

Light emitting device and method of manufacturing the same

Fabrication method of packaging substrate and packaging method using the packaging substrate

Semiconductor device and manufacturing method of semiconductor device using metal oxide

Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrate

Semiconductor device and manufacturing method of semiconductor device using metal oxide

Structure including gallium nitride substrate and method of manufacturing the gallium nitride substrate

Backlight module including at least one luminescence element, and method of fabricating the same

SAMSUNG ELECTRO MECH

Piezoelectric inkjet printhead

Piezoelectric inkjet printhead

Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator

Inkjet printhead having piezoelectric actuator and method of driving the piezoelectric actuator

SAMSUNG LED CO LTD

LED package structure and manufacturing method, and LED array module

LED array module

LEE CHANG-SEUNG

Transistors and methods of manufacturing the same

Graphene device and method of manufacturing the same

KWON KI-HWAN

LED package and fabrication method thereof

Method of manufacturing image forming element, image forming element, and image forming apparatus having the same

SHIN KYU-HO

Flexible device, flexible pressure sensor

LEE JEONG-YUB

Electrode structures, gallium nitride based semiconductor devices including the same and methods of manufacturing the same

XIANYU WENXU

Graphene devices and methods of manufacturing the same

CHO EUN-HYOUNG

Superhydrophobic electromagnetic field shielding material and method of preparing the same

SHIN SU HO

Image forming element and manufacturing method thereof

CHOI WON-KYOUNG

Soldering structure and method using Zn

BAE KI-DEOK

Electrowetting device and method of manufacturing the same

WENXU XIANYU

Selective low-temperature ohmic contact formation method for group III-nitride heterojunction structured device

SHIN SU-HO

LED package structure and manufacturing method, and LED array module