Inventor
ARAI KAZUHISA
JP21 patents
⚠️ This page may combine multiple inventors who share the name “ARAI KAZUHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
19 patentsUS6528864B1Mar 4, 2003
Semiconductor wafer having regular or irregular chip pattern and dicing method for the same
DISCO CORP180 citations98
US6527627B2Mar 4, 2003
Semiconductor wafer grinding method
DISCO CORP26 citations92
US6676491B2Jan 13, 2004
Semiconductor wafer dividing method
DISCO CORP30 citations90
US7183178B2Feb 27, 2007
Method of manufacturing semiconductor wafer
DISCO CORP12 citations83
US6927416B2Aug 9, 2005
Wafer support plate
DISCO CORP14 citations83
US6702652B2Mar 9, 2004
Method of grinding rear side of semiconductor wafer
DISCO CORP18 citations83
US6500047B2Dec 31, 2002
Semiconductor wafer cutting machine
DISCO CORP16 citations81
US9400423B2Jul 26, 2016
Manufacturing method for photomask
DISCO CORP3 citations72
US6759274B2Jul 6, 2004
Semiconductor chip pick-up method
DISCO CORP12 citations71
US6594890B2Jul 22, 2003
Method of separating a plate-like workpiece held by adhesion on an elastic adsorption pad
DISCO CORP8 citations71
US6358132B1Mar 19, 2002
Apparatus for grinding spherical objects
DISCO CORP9 citations71
US7816264B2Oct 19, 2010
Wafer processing method
DISCO CORP2 citations62
US7498239B2Mar 3, 2009
Wafer processing method
DISCO CORP4 citations62
US7727810B2Jun 1, 2010
Wafer dividing method
DISCO CORP5 citations61
US7687375B2Mar 30, 2010
Lamination device manufacturing method
DISCO CORP3 citations61
US7222772B2May 29, 2007
Flip chip bonder
DISCO CORP2 citations61
US7278206B2Oct 9, 2007
Method of preparing terminal board
DISCO CORP1 citations49
US9627241B2Apr 18, 2017
Resin sheet attaching method
DISCO CORP0 citations41
US7704769B2Apr 27, 2010
Optical device manufacturing method
DISCO CORP0 citations41