Inventor
GOTO YUICHIRO
JP30 patents
⚠️ This page may combine multiple inventors who share the name “GOTO YUICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJIFILM CORP
22 patentsUS9482950B2Nov 1, 2016
Curable composition for imprints, pattern-forming method and pattern
FUJIFILM CORP3 citations73
US10246605B2Apr 2, 2019
Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device
FUJIFILM CORP4 citations72
US11435663B2Sep 6, 2022
Curable composition for imprinting, method of manufacturing cured product pattern, method of manufacturing circuit substrate, and cured product
FUJIFILM CORP0 citations62
US10504739B2Dec 10, 2019
Curable composition for optical imprinting and pattern forming method
FUJIFILM CORP1 citations62
US10261413B2Apr 16, 2019
Photocurable composition for imprints, pattern forming method, and method for manufacturing device
FUJIFILM CORP1 citations62
US12497469B2Dec 16, 2025
Composition for forming pattern, kit, pattern producing method, pattern, and method for manufacturing semiconductor element
FUJIFILM CORP0 citations61
US12379658B2Aug 5, 2025
Curable composition for imprinting, method for producing curable composition for imprinting, cured product, pattern producing method, and method for manufacturing semiconductor element
FUJIFILM CORP0 citations61
US10191375B2Jan 29, 2019
Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit and process for producing device
FUJIFILM CORP1 citations61
US12421343B2Sep 23, 2025
Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element
FUJIFILM CORP0 citations60
US12109752B2Oct 8, 2024
Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor element
FUJIFILM CORP0 citations60
US11710641B2Jul 25, 2023
Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device
FUJIFILM CORP1 citations60
US11029597B2Jun 8, 2021
Method for producing pattern laminate, method for producing reversal pattern, and pattern laminate
FUJIFILM CORP1 citations59
US11441053B2Sep 13, 2022
Composition for forming adhesive film for imprinting, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate
FUJIFILM CORP0 citations51
US11401361B2Aug 2, 2022
Curable composition for imprinting, cured product, pattern forming method, lithography method, pattern, mask for lithography, and polymerizable composition for imprinting
FUJIFILM CORP0 citations51
US11299653B2Apr 12, 2022
Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate
FUJIFILM CORP0 citations51
US10990011B2Apr 27, 2021
Curable composition for imprinting, cured product, pattern forming method, and lithography method
FUJIFILM CORP0 citations51
US10189928B2Jan 29, 2019
Curable composition, pattern forming method, pattern, and method for manufacturing device
FUJIFILM CORP0 citations51
US9862847B2Jan 9, 2018
Inkjet discharge method, pattern formation method, and pattern
FUJIFILM CORP1 citations51
US12091497B2Sep 17, 2024
Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film for imprinting, pattern producing method, method for manufacturing semiconductor element, cured product, and kit
FUJIFILM CORP0 citations50
US11899361B2Feb 13, 2024
Kit, composition for forming underlayer film for imprinting, laminate, and production method using the same
FUJIFILM CORP0 citations50
US10175576B2Jan 8, 2019
Curable composition for photo imprints, method for forming pattern, fine pattern, and method for manufacturing semiconductor device
FUJIFILM CORP0 citations41
US10373863B2Aug 6, 2019
Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure
FUJIFILM CORP0 citations40