P

Inventor

GOTO YUICHIRO

JP30 patents
⚠️ This page may combine multiple inventors who share the name “GOTO YUICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJIFILM CORP

22 patents
US9482950B2Nov 1, 2016

Curable composition for imprints, pattern-forming method and pattern

FUJIFILM CORP3 citations73
US10246605B2Apr 2, 2019

Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device

FUJIFILM CORP4 citations72
US11435663B2Sep 6, 2022

Curable composition for imprinting, method of manufacturing cured product pattern, method of manufacturing circuit substrate, and cured product

FUJIFILM CORP0 citations62
US10504739B2Dec 10, 2019

Curable composition for optical imprinting and pattern forming method

FUJIFILM CORP1 citations62
US10261413B2Apr 16, 2019

Photocurable composition for imprints, pattern forming method, and method for manufacturing device

FUJIFILM CORP1 citations62
US12497469B2Dec 16, 2025

Composition for forming pattern, kit, pattern producing method, pattern, and method for manufacturing semiconductor element

FUJIFILM CORP0 citations61
US12379658B2Aug 5, 2025

Curable composition for imprinting, method for producing curable composition for imprinting, cured product, pattern producing method, and method for manufacturing semiconductor element

FUJIFILM CORP0 citations61
US10191375B2Jan 29, 2019

Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit and process for producing device

FUJIFILM CORP1 citations61
US12421343B2Sep 23, 2025

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element

FUJIFILM CORP0 citations60
US12109752B2Oct 8, 2024

Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor element

FUJIFILM CORP0 citations60
US11710641B2Jul 25, 2023

Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device

FUJIFILM CORP1 citations60
US11029597B2Jun 8, 2021

Method for producing pattern laminate, method for producing reversal pattern, and pattern laminate

FUJIFILM CORP1 citations59
US11441053B2Sep 13, 2022

Composition for forming adhesive film for imprinting, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

FUJIFILM CORP0 citations51
US11401361B2Aug 2, 2022

Curable composition for imprinting, cured product, pattern forming method, lithography method, pattern, mask for lithography, and polymerizable composition for imprinting

FUJIFILM CORP0 citations51
US11299653B2Apr 12, 2022

Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

FUJIFILM CORP0 citations51
US10990011B2Apr 27, 2021

Curable composition for imprinting, cured product, pattern forming method, and lithography method

FUJIFILM CORP0 citations51
US10189928B2Jan 29, 2019

Curable composition, pattern forming method, pattern, and method for manufacturing device

FUJIFILM CORP0 citations51
US9862847B2Jan 9, 2018

Inkjet discharge method, pattern formation method, and pattern

FUJIFILM CORP1 citations51
US12091497B2Sep 17, 2024

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film for imprinting, pattern producing method, method for manufacturing semiconductor element, cured product, and kit

FUJIFILM CORP0 citations50
US11899361B2Feb 13, 2024

Kit, composition for forming underlayer film for imprinting, laminate, and production method using the same

FUJIFILM CORP0 citations50
US10175576B2Jan 8, 2019

Curable composition for photo imprints, method for forming pattern, fine pattern, and method for manufacturing semiconductor device

FUJIFILM CORP0 citations41
US10373863B2Aug 6, 2019

Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

FUJIFILM CORP0 citations40

KOBE STEEL LTD

2 patents

KUBOTA KK

1 patent

GAS RES INST

1 patent

YAZAKI CORP

1 patent

SAMSUNG ELECTRONICS CO LTD

1 patent

MAEDA KAORU

1 patent

BOSCH CORP

1 patent