Inventor · disambiguated record
Jia-Wei Fang
Also filed as: FANG JIA-WEI
13 granted patents·3 pending applications·30 citations·filing 2014–2025
87Inventor score
Files withMEDIATEK INC16
Top patents by PatentIndex Score
16 records- 0188US9589092B2Method for co-designing flip-chip and interposerMEDIATEK INC·Filed 2014·Granted Mar 7, 2017·11 cites·16 claims
- 0285US9904752B2Methods for distributing power in layout of ICMEDIATEK INC·Filed 2015·Granted Feb 27, 2018·6 cites·24 claims
- 0383US9379079B1Flip chip scheme and method of forming flip chip schemeMEDIATEK INC·Filed 2015·Granted Jun 28, 2016·5 cites·24 claims
- 0477US2025377649A1Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2025·Application pending·0 cites
- 0576US9660017B2Microelectronic package with surface mounted passive elementMEDIATEK INC·Filed 2015·Granted May 23, 2017·3 cites·9 claims
- 0675US9904751B2Computer-implemented method of designing a modularized stacked integrated circuitMEDIATEK INC·Filed 2015·Granted Feb 27, 2018·3 cites·11 claims
- 0769US12411474B2Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2022·Granted Sep 9, 2025·0 cites·26 claims
- 0868US10067000B2Inverter and ring oscillator with high temperature sensitivityMEDIATEK INC·Filed 2015·Granted Sep 4, 2018·1 cites·15 claims
- 0963US11989005B2Adaptive thermal ceiling control systemMEDIATEK INC·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1063US9305131B2Method for flip chip packaging co-designMEDIATEK INC·Filed 2014·Granted Apr 5, 2016·1 cites·21 claims
- 1152US10109566B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Oct 23, 2018·0 cites·17 claims
- 1251US9552452B2Method and apparatus for flip chip packaging co-design and co-designed flip chip packageMEDIATEK INC·Filed 2016·Granted Jan 24, 2017·0 cites·20 claims
- 1349US9679830B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Jun 13, 2017·0 cites·4 claims
- 1444US9490808B2Sensing circuitMEDIATEK INC·Filed 2015·Granted Nov 8, 2016·0 cites·20 claims
- 1535US2016343796A1Capacitor structure and method for forming the sameMEDIATEK INC·Filed 2016·Application pending·0 cites
- 1634US2016197071A1Integrated circuit device and method for forming the sameMEDIATEK INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →