P

Inventor

AUBERTINE DANIEL B

US23 patents
⚠️ This page may combine multiple inventors who share the name “AUBERTINE DANIEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

17 patents
US9343559B2May 17, 2016

Nanowire transistor devices and forming techniques

INTEL CORP25 citations94
US9812524B2Nov 7, 2017

Nanowire transistor devices and forming techniques

INTEL CORP13 citations84
US9653584B2May 16, 2017

Pre-sculpting of Si fin elements prior to cladding for transistor channel applications

INTEL CORP7 citations84
US9184294B2Nov 10, 2015

High mobility strained channels for fin-based transistors

INTEL CORP11 citations84
US10373977B2Aug 6, 2019

Transistor fin formation via cladding on sacrificial core

INTEL CORP6 citations73
US9893149B2Feb 13, 2018

High mobility strained channels for fin-based transistors

INTEL CORP3 citations73
US11171058B2Nov 9, 2021

Self-aligned 3-D epitaxial structures for MOS device fabrication

INTEL CORP0 citations62
US10879241B2Dec 29, 2020

Techniques for controlling transistor sub-fin leakage

INTEL CORP1 citations62
US10396203B2Aug 27, 2019

Pre-sculpting of Si fin elements prior to cladding for transistor channel applications

INTEL CORP0 citations52
US10014412B2Jul 3, 2018

Pre-sculpting of Si fin elements prior to cladding for transistor channel applications

INTEL CORP0 citations52
US10559689B2Feb 11, 2020

Crystallized silicon carbon replacement material for NMOS source/drain regions

INTEL CORP0 citations51
US9660078B2May 23, 2017

Enhanced dislocation stress transistor

INTEL CORP0 citations51
US9231076B2Jan 5, 2016

Enhanced dislocation stress transistor

INTEL CORP0 citations51
US9076814B2Jul 7, 2015

Enhanced dislocation stress transistor

INTEL CORP0 citations51
US10084087B2Sep 25, 2018

Enhanced dislocation stress transistor

INTEL CORP0 citations50
US7833883B2Nov 16, 2010

Precursor gas mixture for depositing an epitaxial carbon-doped silicon film

INTEL CORP1 citations46
US10403626B2Sep 3, 2019

Fin sculpting and cladding during replacement gate process for transistor channel applications

INTEL CORP0 citations42

GLASS GLENN A

3 patents

CEA STEPHEN M

1 patent

WEBER CORY

1 patent

TAHOE RES LTD

1 patent