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Inventor
LEE KO-YI
TW
6 patents
⚠️ This page may combine multiple inventors who share the name “LEE KO-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
3 patents
US7148574B2
Dec 12, 2006
Bonding pad structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG
30 citations
91
US7939824B2
May 10, 2011
Test structure
TAIWAN SEMICONDUCTOR MFG
2 citations
60
US7498680B2
Mar 3, 2009
Test structure
TAIWAN SEMICONDUCTOR MFG
1 citations
49
TAIWAN SEMICONDUCTOR MFG CO LTD
2 patents
US9431356B2
Aug 30, 2016
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD
0 citations
49
US10283468B1
May 7, 2019
Package structures
TAIWAN SEMICONDUCTOR MFG CO LTD
0 citations
39
HONGFUJIN PREC IND SHENZHEN
1 patent
US10085204B2
Sep 25, 2018
Data transmission system and communication method
HONGFUJIN PREC IND SHENZHEN
0 citations
30