Inventor
KANG HEEYOUB
KR12 patents
Patents
12 patentsUS10175667B2Jan 8, 2019
Storage devices including dynamic internal thermal throttling
SAMSUNG ELECTRONICS CO LTD21 citations90
US9990964B1Jun 5, 2018
Storage device operating differently according to temperature of memory
SAMSUNG ELECTRONICS CO LTD10 citations83
US11954938B2Apr 9, 2024
Fingerprint sensor package and smart card including fingerprint sensor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10529692B2Jan 7, 2020
Semiconductor module including package and heat transfer structure
SAMSUNG ELECTRONICS CO LTD2 citations70
US9437518B2Sep 6, 2016
Semiconductor module
SAMSUNG ELECTRONICS CO LTD5 citations68
US10317922B2Jun 11, 2019
Power supply management circuit configured to manage power transfer with limiting current intensity, and storage device and communication cable including the same
SAMSUNG ELECTRONICS CO LTD2 citations67
US11205601B2Dec 21, 2021
Semiconductor package and semiconductor apparatus
SAMSUNG ELECTRONICS CO LTD0 citations56
US11681599B2Jun 20, 2023
Storage device, method of operating the same, and method of providing a plurality of performance tables
SAMSUNG ELECTRONICS CO LTD0 citations55
US10713105B2Jul 14, 2020
Operating method of memory controller, storage device including the same, and operating method of storage device
SAMSUNG ELECTRONICS CO LTD0 citations50
US10840221B2Nov 17, 2020
Semiconductor module
SAMSUNG ELECTRONICS CO LTD0 citations49
US10593648B2Mar 17, 2020
Heart transfer label structure
SAMSUNG ELECTRONICS CO LTD0 citations49
US10212808B2Feb 19, 2019
Printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations35