Inventor
VAN GEMERT LEO
NL15 patents
⚠️ This page may combine multiple inventors who share the name “VAN GEMERT LEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
11 patentsUS10615134B2Apr 7, 2020
Integrated circuit package
NXP BV4 citations68
US10109564B2Oct 23, 2018
Wafer level chip scale semiconductor package
NXP BV2 citations68
US10825789B1Nov 3, 2020
Underbump metallization dimension variation with improved reliability
NXP BV2 citations67
US10315821B2Jun 11, 2019
Component carrier
NXP BV1 citations60
US12183595B2Dec 31, 2024
Selective underfill assembly and method therefor
NXP BV0 citations56
US11557491B2Jan 17, 2023
Selective underfill assembly and method therefor
NXP BV0 citations56
US11508669B2Nov 22, 2022
Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials
NXP BV0 citations53
US8679963B2Mar 25, 2014
Fan-out chip scale package
NXP BV2 citations53
US11963291B2Apr 16, 2024
Efficient wave guide transition between package and PCB using solder wall
NXP BV0 citations51
US12476355B2Nov 18, 2025
System
NXP BV0 citations42
US10613136B2Apr 7, 2020
Apparatus comprising a semiconductor arrangement
NXP BV0 citations30