Inventor
ALUR AMRUTHAVALLI PALLAVI
US22 patents
Patents
22 patentsUS10163798B1Dec 25, 2018
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
INTEL CORP105 citations99
US10707168B2Jul 7, 2020
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
INTEL CORP7 citations84
US11430740B2Aug 30, 2022
Microelectronic device with embedded die substrate on interposer
INTEL CORP2 citations73
US11043457B2Jun 22, 2021
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
INTEL CORP3 citations73
US9953959B1Apr 24, 2018
Metal protected fan-out cavity
INTEL CORP4 citations73
US10998262B2May 4, 2021
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP1 citations72
US10624213B1Apr 14, 2020
Asymmetric electronic substrate and method of manufacture
INTEL CORP5 citations72
US9603247B2Mar 21, 2017
Electronic package with narrow-factor via including finish layer
INTEL CORP3 citations72
US10741947B2Aug 11, 2020
Plated through hole socketing coupled to a solder ball to engage with a pin
INTEL CORP2 citations71
US10734358B2Aug 4, 2020
Multi-packaging for single-socketing
INTEL CORP3 citations71
US11923257B2Mar 5, 2024
Hybrid microelectronic substrates
INTEL CORP2 citations70
US11114353B2Sep 7, 2021
Hybrid microelectronic substrates
INTEL CORP2 citations70
US12400952B2Aug 26, 2025
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US12272650B2Apr 8, 2025
Microelectronic package with substrate cavity for bridge-attach
INTEL CORP0 citations62
US12046560B2Jul 23, 2024
Microelectronic device with embedded die substrate on interposer
INTEL CORP0 citations62
US11908793B2Feb 20, 2024
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US11894311B2Feb 6, 2024
Microelectronic device with embedded die substrate on interposer
INTEL CORP0 citations62
US11764158B2Sep 19, 2023
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
INTEL CORP0 citations62
US11658111B2May 23, 2023
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
INTEL CORP0 citations62
US11107780B2Aug 31, 2021
Pseudo-stripline using double solder-resist structure
INTEL CORP1 citations62
US10980129B2Apr 13, 2021
Asymmetric electronic substrate and method of manufacture
INTEL CORP0 citations62
US11075130B2Jul 27, 2021
Package substrate having polymer-derived ceramic core
INTEL CORP0 citations58