Inventor
KAJIYAMA KEIICHI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KAJIYAMA KEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
12 patentsUS6939785B2Sep 6, 2005
Process for manufacturing a semiconductor chip
DISCO CORP25 citations92
US7629230B2Dec 8, 2009
Wafer processing method
DISCO CORP8 citations84
US8025556B2Sep 27, 2011
Method of grinding wafer
DISCO CORP14 citations83
US7677955B2Mar 16, 2010
Grinding method for wafer
DISCO CORP12 citations82
US7527547B2May 5, 2009
Wafer processing method
DISCO CORP8 citations82
US6306274B1Oct 23, 2001
Method for making electrodeposition blades
DISCO CORP9 citations73
US6171176B1Jan 9, 2001
Method of effecting a precision saw-toothed grinding on the surface of a given workpiece
DISCO CORP12 citations73
US7858530B2Dec 28, 2010
Processing method for wafer and processing apparatus therefor
DISCO CORP6 citations62
US7816264B2Oct 19, 2010
Wafer processing method
DISCO CORP2 citations62
US7718511B2May 18, 2010
Processing method for wafer
DISCO CORP3 citations62
US7858496B2Dec 28, 2010
Wafer processing method
DISCO CORP2 citations56
US7625810B2Dec 1, 2009
Wafer processing method
DISCO CORP1 citations51