Inventor

OBATA SHIMPEI

JP4 patents

Patents

4 patents

US12021015B2Jun 25, 2024

Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate

PANASONIC IP MAN CO LTD0 citations56

US11647583B2May 9, 2023

Prepreg, metal-clad laminated board, and printed wiring board

PANASONIC IP MAN CO LTD0 citations41

US11414528B2Aug 16, 2022

Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

PANASONIC IP MAN CO LTD0 citations39

US10472478B2Nov 12, 2019

Prepreg, metal-clad laminate and printed wiring board

PANASONIC IP MAN CO LTD0 citations35