Inventor
KIM DUCKGYU
KR5 patents
Patents
5 patentsUS11600556B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11756869B2Sep 12, 2023
Semiconductor package having UBM pad with gap separating central portion from peripheral portion
SAMSUNG ELECTRONICS CO LTD0 citations58
US11276633B2Mar 15, 2022
Semiconductor package having UBM pad with gap separating central portion from peripheral portion
SAMSUNG ELECTRONICS CO LTD0 citations58
US11728261B2Aug 15, 2023
Chip on film package and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations54
US11682633B2Jun 20, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48