Inventor
HA JEONG-KYU
KR29 patents
⚠️ This page may combine multiple inventors who share the name “HA JEONG-KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS8853694B2Oct 7, 2014
Chip on film package including test pads and semiconductor devices including the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US9177904B2Nov 3, 2015
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD16 citations91
US9349683B2May 24, 2016
Chip-on-film package having bending part
SAMSUNG ELECTRONICS CO LTD7 citations84
US7915727B2Mar 29, 2011
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD8 citations82
US10504829B2Dec 10, 2019
Semiconductor package and semiconductor module including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10134667B2Nov 20, 2018
Chip-on-film semiconductor packages and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9978674B2May 22, 2018
Chip-on-film semiconductor packages and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10304764B2May 28, 2019
Film product, film packages and package modules using the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9922891B2Mar 20, 2018
Film for semiconductor package, semiconductor package using film and display device including the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9241407B2Jan 19, 2016
Tape film packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9437526B2Sep 6, 2016
Chip on film package including distributed via plugs
SAMSUNG ELECTRONICS CO LTD4 citations70
US9305990B2Apr 5, 2016
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US12191246B2Jan 7, 2025
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11830803B2Nov 28, 2023
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600556B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US10282587B2May 7, 2019
Sensing module substrate and sensing module including the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US9362333B2Jun 7, 2016
Semiconductor packages and display devices including semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations52
US9576865B2Feb 21, 2017
Film for semiconductor package, semiconductor package using film and display device including the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US9620389B2Apr 11, 2017
Methods of fabricating tape film packages
SAMSUNG ELECTRONICS CO LTD1 citations50
US10776601B2Sep 15, 2020
Fingerprint sensor package and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US11764140B2Sep 19, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US9313889B2Apr 12, 2016
Display apparatus
SAMSUNG ELECTRONICS CO LTD0 citations45