Inventor

EGUSA MINORU

JP6 patents

Patents

6 patents

US9640453B2May 2, 2017

Power semiconductor device

MITSUBISHI ELECTRIC CORP4 citations66

US9979105B2May 22, 2018

Power semiconductor device

MITSUBISHI ELECTRIC CORP1 citations49

US11631653B2Apr 18, 2023

Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method

MITSUBISHI ELECTRIC CORP0 citations46

US11742251B2Aug 29, 2023

Power semiconductor device including press-fit connection terminal

MITSUBISHI ELECTRIC CORP0 citations45

US9887142B2Feb 6, 2018

Power semiconductor device

MITSUBISHI ELECTRIC CORP0 citations45

US10388581B2Aug 20, 2019

Semiconductor device having press-fit terminals disposed in recesses in a case frame

MITSUBISHI ELECTRIC CORP0 citations39