Inventor
PARK SAEHAN
US13 patents
Patents
13 patentsUS11881455B2Jan 23, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations84
US12230571B2Feb 18, 2025
Integrated circuit devices including a power rail and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12125788B2Oct 22, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11769728B2Sep 26, 2023
Backside power distribution network semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12557677B2Feb 17, 2026
Backside power distribution network semiconductor architecture using direct epitaxial layer connection and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12142564B2Nov 12, 2024
Backside power distribution network semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12183738B2Dec 31, 2024
Cross-coupled gate design for stacked device with separated top-down gate
SAMSUNG ELECTRONICS CO LTD0 citations51
US12144163B2Nov 12, 2024
Selective double diffusion break structures for multi-stack semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12131996B2Oct 29, 2024
Stacked device with backside power distribution network and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12588249B2Mar 24, 2026
Integrated circuit devices including a cross-coupled structure
SAMSUNG ELECTRONICS CO LTD0 citations50
US12374623B2Jul 29, 2025
Stacked semiconductor device architecture
SAMSUNG ELECTRONICS CO LTD0 citations50
US12364018B2Jul 15, 2025
Limited lateral growth of S/D epi by outer dielectric layer in 3-dimensional stacked device
SAMSUNG ELECTRONICS CO LTD0 citations50
US12588489B2Mar 24, 2026
Integrated circuit devices including stacked elements and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations47