Inventor
SEO HOONSEOK
US12 patents
Patents
12 patentsUS11881455B2Jan 23, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations84
US12230571B2Feb 18, 2025
Integrated circuit devices including a power rail and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12125788B2Oct 22, 2024
Through silicon buried power rail implemented backside power distribution network semiconductor architecture and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11769728B2Sep 26, 2023
Backside power distribution network semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US12317582B2May 27, 2025
Integrated circuit devices including a metal resistor and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12142564B2Nov 12, 2024
Backside power distribution network semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12243820B2Mar 4, 2025
Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12218054B2Feb 4, 2025
Method of forming an integrated circuit device having an etch-stop layer between metal wires
SAMSUNG ELECTRONICS CO LTD0 citations58
US11990409B2May 21, 2024
Semiconductor device with fine metal lines for BEOL structure and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US11450608B2Sep 20, 2022
Integrated circuit devices including metal wires having etch stop layers on sidewalls thereof
SAMSUNG ELECTRONICS CO LTD0 citations58
US12014951B2Jun 18, 2024
Semi-damascene structure with dielectric hardmask layer
SAMSUNG ELECTRONICS CO LTD0 citations57
US11488864B2Nov 1, 2022
Self-aligned supervia and metal direct etching process to manufacture self-aligned supervia
SAMSUNG ELECTRONICS CO LTD0 citations47