Inventor
LIANG ZHENG-YONG
TW8 patents
⚠️ This page may combine multiple inventors who share the name “LIANG ZHENG-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS11942358B2Mar 26, 2024
Low thermal budget dielectric for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12550720B2Feb 10, 2026
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12532716B2Jan 20, 2026
Low thermal budget dielectric for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12347717B2Jul 1, 2025
Debonding structures for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12512439B2Dec 30, 2025
Wafer bonding method and semiconductor structure obtained by the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12489082B2Dec 2, 2025
Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49