Inventor

WIDDOWSON GARY PETER

HK34 patents

⚠️ This page may combine multiple inventors who share the name “WIDDOWSON GARY PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WIDDOWSON GARY PETER

ASM TECH SINGAPORE PTE LTD

Force sensing apparatus

Linear actuator comprising velocity sensor

Lightweight bondhead assembly

Clamp actuation mechanism

Determination of a movable gantry position including a dual measurement module

Clamping device

Motor system for positioning a load

Force sensing apparatus

Die ejector system using linear motor

Direct drive robotic manipulator

Testing of LED devices during pick and place operations

Atomization mechanism for cooling a bond head

Translation mechanism for opto-mechanical inspection

Pick arm comprising a winged part for a bonding apparatus

ASM ASSEMBLY AUTOMATION LTD

Dual-axis planar motor providing force constant and thermal stability

Linear motor driven mechanism using flexure bearings for opto-mechanical devices

Die detachment apparatus comprising pre-peeling structure

Wedge bonding head

Driving mechanism for chip detachment apparatus

Decoupling of actuators for positioning an object

Driving mechanism having position encoder for two-dimensional positioning

Linear motor having dual coil configuration

Driving mechanism having position encoder for two-dimensional positioning

Rotary bonding tool which provides a large bond force

YUNG CHUNG SHEUNG

Apparatus for aligning a bonding tool of a die bonder

Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck

GAN WAI CHUEN

Multiple-phase linear switched reluctance motor

Direct current motor incorporating thermal control

GAUNEKAR AJIT

Gantry positioning system

LAW YI KEI

Bond head cooling apparatus

ASMPT SINGAPORE PTE LTD

Compliant locating structure for a bond head assembly

HUNG KIN YIK

Bond head for thermal compression die bonding

WIDDOWSON GARY PETER

System for maintaining thermal stability of a motion stage

PAN XIANGSHENG

Collet mounting assembly for a die bonder