P

Inventor

TAKAHASHI KUNIYUKI

JP62 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI KUNIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKAWA KK

28 patents
US7857190B2Dec 28, 2010

Wire bonding apparatus, record medium storing bonding control program, and bonding method

SHINKAWA KK67 citations97
US5388751AFeb 14, 1995

Wire clamper

SHINKAWA KK51 citations93
US6080651AJun 27, 2000

Wire bonding method

SHINKAWA KK22 citations92
US6041995AMar 28, 2000

Wire bonding method

SHINKAWA KK42 citations92
US6036080AMar 14, 2000

Wire bonding method

SHINKAWA KK20 citations92
US5616257AApr 1, 1997

Wire bonding method and apparatus

SHINKAWA KK27 citations92
US5364009ANov 15, 1994

Ultrasonic wire bonding method

SHINKAWA KK26 citations92
US5156323AOct 20, 1992

Wire bonding method

SHINKAWA KK30 citations92
US7686204B2Mar 30, 2010

Wire bonding apparatus, record medium storing bonding control program, and bonding method

SHINKAWA KK13 citations83
US6173885B1Jan 16, 2001

Method for forming a ball in wire bonding

SHINKAWA KK7 citations74
US5297722AMar 29, 1994

Wire bonding method and apparatus

SHINKAWA KK10 citations74
US5259548ANov 9, 1993

Wire bonding method

SHINKAWA KK11 citations74
US6542783B2Apr 1, 2003

Tool position measurement method, offset measurement method, reference member and bonding apparatus

SHINKAWA KK9 citations73
US6206266B1Mar 27, 2001

Control method for wire bonding apparatus

SHINKAWA KK12 citations73
US6119917ASep 19, 2000

Wire bonding apparatus and bonding load correction method for the same

SHINKAWA KK13 citations73
US6095396AAug 1, 2000

Bonding load correction method and wire bonding apparatus

SHINKAWA KK8 citations73
US6070778AJun 6, 2000

Wire bonding apparatus and control method thereof

SHINKAWA KK14 citations73
US5957371ASep 28, 1999

Method and apparatus for forming a ball in wire bonding

SHINKAWA KK8 citations73
US5900106AMay 4, 1999

Bonding apparatus

SHINKAWA KK10 citations69
US5360155ANov 1, 1994

Wire bonding apparatus

SHINKAWA KK14 citations67
US5234155AAug 10, 1993

Wire bonding method and apparatus

SHINKAWA KK6 citations63
US5137201AAug 11, 1992

Wire bonding method

SHINKAWA KK4 citations63
US6362014B1Mar 26, 2002

Bonding apparatus

SHINKAWA KK2 citations62
US6302312B1Oct 16, 2001

Bonding apparatus and method

SHINKAWA KK2 citations62
US6119914ASep 19, 2000

Wire bonding apparatus

SHINKAWA KK2 citations62
US5949208ASep 7, 1999

Circuit and method for controlling a DC motor

SHINKAWA KK4 citations62
US5613000AMar 18, 1997

Method and apparatus for changing the data setting modes in a bonding machine

SHINKAWA KK4 citations61
US6727666B2Apr 27, 2004

XY table for a semiconductor manufacturing apparatus

SHINKAWA KK5 citations58

FUJI ELECTRIC CO LTD

5 patents

KURITA WATER IND LTD

5 patents

YAMAHA MOTOR CO LTD

3 patents

TORAY INDUSTRIES

3 patents

TAKAHASHI KUNIYUKI

2 patents

PREFERRED NETWORKS INC

2 patents

KOBAYASHI YUTA

1 patent

AUDIBLE MAGIC CORP

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.