P

Inventor

NIROOMAND ARDAVAN

US46 patents
⚠️ This page may combine multiple inventors who share the name “NIROOMAND ARDAVAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

37 patents
US7732343B2Jun 8, 2010

Simplified pitch doubling process flow

MICRON TECHNOLOGY INC572 citations99
US7790360B2Sep 7, 2010

Methods of forming multiple lines

MICRON TECHNOLOGY INC60 citations98
US6383723B1May 7, 2002

Method to clean substrate and improve photoresist profile

MICRON TECHNOLOGY INC75 citations96
US6281100B1Aug 28, 2001

Semiconductor processing methods

MICRON TECHNOLOGY INC62 citations96
US7659208B2Feb 9, 2010

Method for forming high density patterns

MICRON TECHNOLOGY INC14 citations93
US6228740B1May 8, 2001

Method of making an antireflective structure

MICRON TECHNOLOGY INC19 citations93
US5990002ANov 23, 1999

Method of making an antireflective structure

MICRON TECHNOLOGY INC23 citations93
US5886391AMar 23, 1999

Antireflective structure

MICRON TECHNOLOGY INC27 citations93
US5259924ANov 9, 1993

Integrated circuit fabrication process to reduce critical dimension loss during etching

MICRON TECHNOLOGY INC27 citations93
US7902074B2Mar 8, 2011

Simplified pitch doubling process flow

MICRON TECHNOLOGY INC26 citations92
US7538036B2May 26, 2009

Methods of forming openings, and methods of forming container capacitors

MICRON TECHNOLOGY INC36 citations92
US7408265B2Aug 5, 2008

Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates

MICRON TECHNOLOGY INC28 citations92
US7321149B2Jan 22, 2008

Capacitor structures, and DRAM arrays

MICRON TECHNOLOGY INC34 citations92
US7153778B2Dec 26, 2006

Methods of forming openings, and methods of forming container capacitors

MICRON TECHNOLOGY INC34 citations92
US6815308B2Nov 9, 2004

Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates

MICRON TECHNOLOGY INC16 citations92
US6461950B2Oct 8, 2002

Semiconductor processing methods, semiconductor circuitry, and gate stacks

MICRON TECHNOLOGY INC16 citations92
US6451504B2Sep 17, 2002

Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitride

MICRON TECHNOLOGY INC19 citations92
US6107002AAug 22, 2000

Reducing resist shrinkage during device fabrication

MICRON TECHNOLOGY INC19 citations92
US5926739AJul 20, 1999

Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitride

MICRON TECHNOLOGY INC31 citations92
US10607844B2Mar 31, 2020

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

MICRON TECHNOLOGY INC4 citations84
US10096483B2Oct 9, 2018

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

MICRON TECHNOLOGY INC6 citations84
US9761457B2Sep 12, 2017

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

MICRON TECHNOLOGY INC7 citations84
US9184159B2Nov 10, 2015

Simplified pitch doubling process flow

MICRON TECHNOLOGY INC7 citations84
US8039399B2Oct 18, 2011

Methods of forming patterns utilizing lithography and spacers

MICRON TECHNOLOGY INC15 citations84
US8003310B2Aug 23, 2011

Masking techniques and templates for dense semiconductor fabrication

MICRON TECHNOLOGY INC15 citations84
US7799694B2Sep 21, 2010

Methods of forming semiconductor constructions

MICRON TECHNOLOGY INC14 citations84
US9305782B2Apr 5, 2016

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

MICRON TECHNOLOGY INC3 citations82
US8030217B2Oct 4, 2011

Simplified pitch doubling process flow

MICRON TECHNOLOGY INC5 citations74
US6693345B2Feb 17, 2004

Semiconductor wafer assemblies comprising photoresist over silicon nitride materials

MICRON TECHNOLOGY INC6 citations74
US6417559B1Jul 9, 2002

Semiconductor wafer assemblies comprising photoresist over silicon nitride materials

MICRON TECHNOLOGY INC10 citations74
US6323139B1Nov 27, 2001

Semiconductor processing methods of forming photoresist over silicon nitride materials

MICRON TECHNOLOGY INC5 citations74
US8871648B2Oct 28, 2014

Method for forming high density patterns

MICRON TECHNOLOGY INC2 citations63
US7057263B2Jun 6, 2006

Semiconductor wafer assemblies comprising photoresist over silicon nitride materials

MICRON TECHNOLOGY INC2 citations63
US6297171B1Oct 2, 2001

Semiconductor processing method of promoting photoresist adhesion to an outer substrate layer predominately comprising silicon nitride

MICRON TECHNOLOGY INC2 citations63
US11335563B2May 17, 2022

Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

MICRON TECHNOLOGY INC0 citations62
US7576400B1Aug 18, 2009

Circuitry and gate stacks

MICRON TECHNOLOGY INC1 citations62
US7821142B2Oct 26, 2010

Intermediate semiconductor device structures

MICRON TECHNOLOGY INC0 citations52

ALAPATI RAMAKANTH

3 patents

ZHOU BAOSUO

2 patents

LODESTAR LICENSING GROUP LLC

2 patents

NIROOMAND ARDAVAN

1 patent

INTEL CORP

1 patent