Inventor
DYER LAWRENCE D
US13 patents
Patents
13 patentsUS4502459AMar 5, 1985
Control of internal diameter saw blade tension in situ
TEXAS INSTRUMENTS INC58 citations95
US4498345AFeb 12, 1985
Method for measuring saw blade flexure
TEXAS INSTRUMENTS INC57 citations94
US5597767AJan 28, 1997
Separation of wafer into die with wafer-level processing
TEXAS INSTRUMENTS INC112 citations92
US5128281AJul 7, 1992
Method for polishing semiconductor wafer edges
TEXAS INSTRUMENTS INC54 citations92
US6063696AMay 16, 2000
Method of reducing wafer particles after partial saw using a superhard protective coating
TEXAS INSTRUMENTS INC67 citations91
US5424224AJun 13, 1995
Method of surface protection of a semiconductor wafer during polishing
TEXAS INSTRUMENTS INC28 citations90
US4501258AFeb 26, 1985
Kerf loss reduction in internal diameter sawing
TEXAS INSTRUMENTS INC48 citations90
US5817569AOct 6, 1998
Method of reducing wafer particles after partial saw
TEXAS INSTRUMENTS INC25 citations89
US5274959AJan 4, 1994
Method for polishing semiconductor wafer edges
TEXAS INSTRUMENTS INC24 citations89
US5289661AMar 1, 1994
Notch beveling on semiconductor wafer edges
TEXAS INSTRUMENTS INC26 citations86
US5595522AJan 21, 1997
Semiconductor wafer edge polishing system and method
TEXAS INSTRUMENTS INC28 citations84
US4935064AJun 19, 1990
Iodine sterilization of deionized water in semiconductor processing
TEXAS INSTRUMENTS INC8 citations72
US5240557AAug 31, 1993
Semiconductor wafer stacking apparatus and method
TEXAS INSTRUMENTS INC17 citations70