Inventor
NAGESH VODDARAHALLI K
US11 patents
⚠️ This page may combine multiple inventors who share the name “NAGESH VODDARAHALLI K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
6 patentsUS5324569AJun 28, 1994
Composite transversely plastic interconnect for microchip carrier
HEWLETT PACKARD CO119 citations97
US5621615AApr 15, 1997
Low cost, high thermal performance package for flip chips with low mechanical stress on chip
HEWLETT PACKARD CO135 citations96
US5155661AOct 13, 1992
Aluminum nitride multi-chip module
HEWLETT PACKARD CO73 citations95
US5113314AMay 12, 1992
High-speed, high-density chip mounting
HEWLETT PACKARD CO44 citations92
US5221421AJun 22, 1993
Controlled etching process for forming fine-geometry circuit lines on a substrate
HEWLETT PACKARD CO35 citations89
US5268048ADec 7, 1993
Reworkable die attachment
HEWLETT PACKARD CO22 citations88
(unassigned)
4 patentsUS5585671ADec 17, 1996
Reliable low thermal resistance package for high power flip clip ICs
116 citations96
US5409157AApr 25, 1995
Composite transversely plastic interconnect for microchip carrier
79 citations94
US5484964AJan 16, 1996
Surface mounting pin grid arrays
50 citations87
US5749988AMay 12, 1998
Reworkable die attachment to heat spreader
7 citations67