Inventor
BEDNARZ GEORGE A
US11 patents
Patents
11 patentsUS6489178B2Dec 3, 2002
Method of fabricating a molded package for micromechanical devices
TEXAS INSTRUMENTS INC111 citations97
US6858910B2Feb 22, 2005
Method of fabricating a molded package for micromechanical devices
TEXAS INSTRUMENTS INC59 citations95
US5106784AApr 21, 1992
Method of making a post molded cavity package with internal dam bar for integrated circuit
TEXAS INSTRUMENTS INC57 citations95
US7026710B2Apr 11, 2006
Molded package for micromechanical devices and method of fabrication
TEXAS INSTRUMENTS INC53 citations92
US5955115ASep 21, 1999
Pre-packaged liquid molding for component encapsulation
TEXAS INSTRUMENTS INC24 citations91
US4874722AOct 17, 1989
Process of packaging a semiconductor device with reduced stress forces
TEXAS INSTRUMENTS INC47 citations90
US6071457AJun 6, 2000
Bellows container packaging system and method
TEXAS INSTRUMENTS INC19 citations88
US5624691AApr 29, 1997
Transfer mold design
TEXAS INSTRUMENTS INC21 citations86
US5912024AJun 15, 1999
Sproutless pre-packaged molding for component encapsulation
TEXAS INSTRUMENTS INC6 citations70
US5744083AApr 28, 1998
Method for molding semiconductor packages
TEXAS INSTRUMENTS INC10 citations66
US6531083B1Mar 11, 2003
Sproutless pre-packaged molding for component encapsulation
TEXAS INSTRUMENTS INC4 citations59