Inventor

HIRATA TERU

JP2 patents

Patents

2 patents

US5766972AJun 16, 1998

Method of making resin encapsulated semiconductor device with bump electrodes

MITSUBISHI ELECTRIC CORP224 citations94

US5521433AMay 28, 1996

IC card including a substrate having improved strength and heat radiation properties

MITSUBISHI ELECTRIC CORP10 citations72