Inventor
WASHIDA TETSURO
JP15 patents
Patents
15 patentsUS5949135ASep 7, 1999
Module mounted with semiconductor device
MITSUBISHI ELECTRIC CORP76 citations96
US6144091ANov 7, 2000
Semiconductor device
MITSUBISHI ELECTRIC CORP29 citations92
US5889327AMar 30, 1999
Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices
MITSUBISHI ELECTRIC CORP25 citations92
US5886874AMar 23, 1999
IC card
MITSUBISHI ELECTRIC CORP44 citations92
US5877548AMar 2, 1999
Terminal configuration in semiconductor IC device
MITSUBISHI ELECTRIC CORP31 citations92
US5774339AJun 30, 1998
IC card and method of making the same
MITSUBISHI ELECTRIC CORP41 citations92
US5719746AFeb 17, 1998
IC card
MITSUBISHI ELECTRIC CORP30 citations92
US5671123ASep 23, 1997
IC card with a discharge pattern and a ground pattern separated from each other
MITSUBISHI ELECTRIC CORP51 citations92
US5585617ADec 17, 1996
Non-contact IC card communicating at multiple frequencies
MITSUBISHI ELECTRIC CORP39 citations92
US6115260ASep 5, 2000
Memory module with obstacle removing terminal structure
MITSUBISHI ELECTRIC CORP40 citations91
US5777275AJul 7, 1998
Bendable circuit board having improved resistance to bending strain and increased element mounting area
MITSUBISHI ELECTRIC CORP18 citations80
US5583748ADec 10, 1996
Semiconductor module having multiple circuit boards
MITSUBISHI ELECTRIC CORP8 citations73
US5521433AMay 28, 1996
IC card including a substrate having improved strength and heat radiation properties
MITSUBISHI ELECTRIC CORP10 citations72
US5521786AMay 28, 1996
Semiconductor module and IC package used for the semiconductor module
MITSUBISHI ELECTRIC CORP2 citations62
US6239981B1May 29, 2001
Packaging substrate
MITSUBISHI ELECTRIC CORP1 citations47