Inventor
MATSUDA TATSUHARU
JP8 patents
Patents
8 patentsUS5666270ASep 9, 1997
Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode
FUJITSU LTD88 citations95
US5831441ANov 3, 1998
Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device
FUJITSU LTD58 citations94
US5574311ANov 12, 1996
Device having pins formed of hardened mixture of conductive metal particle and resin
FUJITSU LTD56 citations94
US5937277AAug 10, 1999
Semiconductor device with reliable electrodes of projecting shape and method of forming same
FUJITSU LTD18 citations92
US5607877AMar 4, 1997
Projection-electrode fabrication method
FUJITSU LTD23 citations92
US5843798ADec 1, 1998
Method for manufacturing semiconductor device having step of forming electrode pins on semiconductor chip using electrode-pin forming mask, and method for testing semiconductor chip using electrode-pin forming mask
FUJITSU LTD28 citations91
US5854558ADec 29, 1998
Test board for testing a semiconductor device and method of testing the semiconductor device
FUJITSU LTD25 citations86
US5637535AJun 10, 1997
Semiconductor device with reliable electrodes of projecting shape and method of forming same
FUJITSU LTD11 citations73