Inventor
MINAMIZAWA MASAHARU
JP17 patents
⚠️ This page may combine multiple inventors who share the name “MINAMIZAWA MASAHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
16 patentsUS6794273B2Sep 21, 2004
Semiconductor device and manufacturing method thereof
FUJITSU LTD81 citations97
US6347037B2Feb 12, 2002
Semiconductor device and method of forming the same
FUJITSU LTD99 citations97
US6781224B2Aug 24, 2004
Semiconductor device and package including forming pyramid mount protruding through silicon substrate
FUJITSU LTD42 citations96
US6875638B2Apr 5, 2005
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
FUJITSU LTD44 citations95
US5666270ASep 9, 1997
Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode
FUJITSU LTD88 citations95
US7193320B2Mar 20, 2007
Semiconductor device having a heat spreader exposed from a seal resin
FUJITSU LTD24 citations92
US6995044B2Feb 7, 2006
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
FUJITSU LTD36 citations92
US6566748B1May 20, 2003
Flip-chip semiconductor device having an improved reliability
FUJITSU LTD42 citations92
US6184133B1Feb 6, 2001
Method of forming an assembly board with insulator filled through holes
FUJITSU LTD26 citations92
US5937277AAug 10, 1999
Semiconductor device with reliable electrodes of projecting shape and method of forming same
FUJITSU LTD18 citations92
US5729435AMar 17, 1998
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD22 citations92
US5607877AMar 4, 1997
Projection-electrode fabrication method
FUJITSU LTD23 citations92
US6905951B2Jun 14, 2005
Method of forming a device substrate and semiconductor package including a pyramid contact
FUJITSU LTD9 citations74
US6088233AJul 11, 2000
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73
US5978222ANov 2, 1999
Semiconductor device and assembly board having through-holes filled with filling core
FUJITSU LTD11 citations73
US5637535AJun 10, 1997
Semiconductor device with reliable electrodes of projecting shape and method of forming same
FUJITSU LTD11 citations73