Inventor

SEITZ MIHEL

US18 patents

⚠️ This page may combine multiple inventors who share the name “SEITZ MIHEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEITZ MIHEL

INFINEON TECHNOLOGIES AG

Method for high aspect ratio gap fill using sequential HDP-CVD

DRAM with vertical transistor and trench capacitor memory cells and method of fabrication

Control of separation between transfer gate and storage node in vertical DRAM

Self-aligned contact formation using double SiN spacers

High aspect ratio high density plasma (HDP) oxide gapfill method in a lines and space pattern

Photomask and method for increasing image aspect ratio while relaxing mask fabrication requirements

Low temperature sidewall oxidation of W/WN/poly-gatestack

DRAM with vertical transistor and trench capacitor memory cells and methods of fabrication

DRAM with very shallow trench isolation

Method for fabricating a trench capacitor

Three layer aluminum deposition process for high aspect ratio CL contacts

Method for fabricating a semiconductor structure

IBM

Pitcher-shaped active area for field effect transistor and method of forming same

Process for protecting array top oxide

Pitcher-shaped active area for field effect transistor and method of forming same

For mol integration

INFINEON TECHNOLOGIES CORP

Method for forming and filling isolation trenches

INFINEON TECHNOLOGIES

Method for fabricating transistors having damascene formed gate contacts and self-aligned borderless bit line contacts