Inventor
GRAHAM LYNDON W
US23 patents
⚠️ This page may combine multiple inventors who share the name “GRAHAM LYNDON W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMITOOL INC
22 patentsUS5985126ANov 16, 1999
Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover
SEMITOOL INC121 citations98
US6508920B1Jan 21, 2003
Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC88 citations97
US6270647B1Aug 7, 2001
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
SEMITOOL INC134 citations97
US6099712AAug 8, 2000
Semiconductor plating bowl and method using anode shield
SEMITOOL INC83 citations95
US6551479B1Apr 22, 2003
Apparatus for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC46 citations94
US7244677B2Jul 17, 2007
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
SEMITOOL INC16 citations92
US6921468B2Jul 26, 2005
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
SEMITOOL INC40 citations92
US6806186B2Oct 19, 2004
Submicron metallization using electrochemical deposition
SEMITOOL INC21 citations92
US6753251B2Jun 22, 2004
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
SEMITOOL INC14 citations92
US6599412B1Jul 29, 2003
In-situ cleaning processes for semiconductor electroplating electrodes
SEMITOOL INC42 citations92
US6358388B1Mar 19, 2002
Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
SEMITOOL INC35 citations92
US7135404B2Nov 14, 2006
Method for applying metal features onto barrier layers using electrochemical deposition
SEMITOOL INC24 citations91
US7462269B2Dec 9, 2008
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
SEMITOOL INC5 citations73
US7144805B2Dec 5, 2006
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
SEMITOOL INC8 citations73
US7001471B2Feb 21, 2006
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC5 citations73
US6663762B2Dec 16, 2003
Plating system workpiece support having workpiece engaging electrode
SEMITOOL INC11 citations73
US7229543B2Jun 12, 2007
Apparatus for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC8 citations72
US7300562B2Nov 27, 2007
Platinum alloy using electrochemical deposition
SEMITOOL INC9 citations71
US6899805B2May 31, 2005
Automated chemical management system executing improved electrolyte analysis method
SEMITOOL INC4 citations63
US6994776B2Feb 7, 2006
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
SEMITOOL INC5 citations62
USRE38931EJan 10, 2006
Methods for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC3 citations61
US6814855B2Nov 9, 2004
Automated chemical management system having improved analysis unit
SEMITOOL INC3 citations60