Inventor
RITZDORF THOMAS L
US37 patents
⚠️ This page may combine multiple inventors who share the name “RITZDORF THOMAS L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMITOOL INC
35 patentsUS6565729B2May 20, 2003
Method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC435 citations99
US6428673B1Aug 6, 2002
Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
SEMITOOL INC102 citations98
US6508920B1Jan 21, 2003
Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC88 citations97
US6270647B1Aug 7, 2001
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
SEMITOOL INC134 citations97
US6334937B1Jan 1, 2002
Apparatus for high deposition rate solder electroplating on a microelectronic workpiece
SEMITOOL INC104 citations95
US6099712AAug 8, 2000
Semiconductor plating bowl and method using anode shield
SEMITOOL INC83 citations95
US6551479B1Apr 22, 2003
Apparatus for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC46 citations94
US7332066B2Feb 19, 2008
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC19 citations93
US7244677B2Jul 17, 2007
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
SEMITOOL INC16 citations92
US7160421B2Jan 9, 2007
Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
SEMITOOL INC24 citations92
US7102763B2Sep 5, 2006
Methods and apparatus for processing microelectronic workpieces using metrology
SEMITOOL INC22 citations92
US6936153B1Aug 30, 2005
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
SEMITOOL INC24 citations92
US6921468B2Jul 26, 2005
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
SEMITOOL INC40 citations92
US6806186B2Oct 19, 2004
Submicron metallization using electrochemical deposition
SEMITOOL INC21 citations92
US6753251B2Jun 22, 2004
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
SEMITOOL INC14 citations92
US6747734B1Jun 8, 2004
Apparatus and method for processing a microelectronic workpiece using metrology
SEMITOOL INC21 citations92
US6599412B1Jul 29, 2003
In-situ cleaning processes for semiconductor electroplating electrodes
SEMITOOL INC42 citations92
US6921467B2Jul 26, 2005
Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
SEMITOOL INC37 citations91
US6592736B2Jul 15, 2003
Methods and apparatus for controlling an amount of a chemical constituent of an electrochemical bath
SEMITOOL INC46 citations91
US7264698B2Sep 4, 2007
Apparatus and methods for electrochemical processing of microelectronic workpieces
SEMITOOL INC11 citations84
US7189318B2Mar 13, 2007
Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
SEMITOOL INC16 citations84
US7161689B2Jan 9, 2007
Apparatus and method for processing a microelectronic workpiece using metrology
SEMITOOL INC12 citations84
US7115196B2Oct 3, 2006
Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
SEMITOOL INC11 citations84
US7020537B2Mar 28, 2006
Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
SEMITOOL INC12 citations84
US7462269B2Dec 9, 2008
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
SEMITOOL INC5 citations73
US7144805B2Dec 5, 2006
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
SEMITOOL INC8 citations73
US7001471B2Feb 21, 2006
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device
SEMITOOL INC5 citations73
US6776892B1Aug 17, 2004
Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face
SEMITOOL INC7 citations73
US6454926B1Sep 24, 2002
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
SEMITOOL INC10 citations73
US7229543B2Jun 12, 2007
Apparatus for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC8 citations72
US7300562B2Nov 27, 2007
Platinum alloy using electrochemical deposition
SEMITOOL INC9 citations71
US7438788B2Oct 21, 2008
Apparatus and methods for electrochemical processing of microelectronic workpieces
SEMITOOL INC2 citations63
US6994776B2Feb 7, 2006
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
SEMITOOL INC5 citations62
USRE38931EJan 10, 2006
Methods for controlling and/or measuring additive concentration in an electroplating bath
SEMITOOL INC3 citations61
US6669834B2Dec 30, 2003
Method for high deposition rate solder electroplating on a microelectronic workpiece
SEMITOOL INC2 citations60