Inventor
KIM YOUNG GON
US61 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNG GON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG ENERGY SOLUTION LTD
11 patentsUS12420303B2Sep 23, 2025
Dual slot die coater and method for coating electrode active material slurry using the same
LG ENERGY SOLUTION LTD2 citations74
US12157140B2Dec 3, 2024
Multi-slot die coater
LG ENERGY SOLUTION LTD5 citations74
US12053796B2Aug 6, 2024
Multi-slot die coater
LG ENERGY SOLUTION LTD5 citations74
US12303932B2May 20, 2025
Multi-slot die coater
LG ENERGY SOLUTION LTD0 citations62
US12576422B2Mar 17, 2026
Magnetism alignment apparatus for negative electrodes and method for manufacturing negative electrodes using same
LG ENERGY SOLUTION LTD0 citations51
US12438182B2Oct 7, 2025
Negative electrode for lithium secondary battery, and method for manufacturing same
LG ENERGY SOLUTION LTD0 citations51
US12406981B2Sep 2, 2025
Negative electrode for lithium secondary battery and lithium secondary battery comprising same
LG ENERGY SOLUTION LTD0 citations51
US12381224B2Aug 5, 2025
Negative electrode for lithium secondary battery and method for manufacturing same
LG ENERGY SOLUTION LTD0 citations51
US12322543B2Jun 3, 2025
Magnetic alignment device for anode, and anode manufacturing method using same
LG ENERGY SOLUTION LTD0 citations51
US12322786B2Jun 3, 2025
Negative electrode for lithium secondary battery, and magnetic alignment device for negative electrode for same
LG ENERGY SOLUTION LTD0 citations51
US12224425B2Feb 11, 2025
Magnetism alignment apparatus for negative electrodes and method for manufacturing negative electrode using same
LG ENERGY SOLUTION LTD0 citations51
TESSERA INC
10 patentsUS7462936B2Dec 9, 2008
Formation of circuitry with modification of feature height
TESSERA INC84 citations98
US7294928B2Nov 13, 2007
Components, methods and assemblies for stacked packages
TESSERA INC151 citations98
US6977440B2Dec 20, 2005
Stacked packages
TESSERA INC168 citations98
US7149095B2Dec 12, 2006
Stacked microelectronic assemblies
TESSERA INC65 citations97
US6897565B2May 24, 2005
Stacked packages
TESSERA INC101 citations97
US7335995B2Feb 26, 2008
Microelectronic assembly having array including passive elements and interconnects
TESSERA INC35 citations92
US7061122B2Jun 13, 2006
Components, methods and assemblies for multi-chip packages
TESSERA INC44 citations92
US6913949B2Jul 5, 2005
Stacked packages
TESSERA INC35 citations92
US7935569B2May 3, 2011
Components, methods and assemblies for stacked packages
TESSERA INC7 citations83
US7816251B2Oct 19, 2010
Formation of circuitry with modification of feature height
TESSERA INC6 citations74
QUALCOMM INC
4 patentsUS9503107B1Nov 22, 2016
Closed loop bank selection for temperature compensation in wireless systems
QUALCOMM INC7 citations82
US10574286B2Feb 25, 2020
High selectivity TDD RF front end
QUALCOMM INC7 citations81
US9385650B2Jul 5, 2016
Transformer feedback voltage controlled oscillator (VCO)
QUALCOMM INC4 citations71
US9473067B2Oct 18, 2016
Reducing mismatch caused by power/ground routing in multi-core VCO structure
QUALCOMM INC2 citations60
INTEGRATED MEMORY LOGIC INC
3 patentsUS6647506B1Nov 11, 2003
Universal synchronization clock signal derived using single forward and reverse direction clock signals even when phase delay between both signals is greater than one cycle
INTEGRATED MEMORY LOGIC INC48 citations95
US7043657B1May 9, 2006
Universal synchronization clock signal derived using single forward and reverse direction clock signals even when phase delay between both signals is greater than one cycle
INTEGRATED MEMORY LOGIC INC30 citations92
US6937664B1Aug 30, 2005
System and method for multi-symbol interfacing
INTEGRATED MEMORY LOGIC INC15 citations81
LG SEMICON CO LTD
3 patentsUS5748450AMay 5, 1998
BGA package using a dummy ball and a repairing method thereof
LG SEMICON CO LTD24 citations92
US6105847AAug 22, 2000
Nozzle structure of repair apparatus for semiconductor package
LG SEMICON CO LTD8 citations74
US6010058AJan 4, 2000
BGA package using a dummy ball and a repairing method thereof
LG SEMICON CO LTD9 citations73
KIM YOUNG GON
3 patentsAVAGO TECH FIBER IP SG PTE LTD
3 patentsUS7564882B2Jul 21, 2009
Integrated circuit having on-chip laser burn-in circuit
AVAGO TECH FIBER IP SG PTE LTD5 citations62
US7167491B2Jan 23, 2007
Eye diagram improving method for laser transmitter
AVAGO TECH FIBER IP SG PTE LTD4 citations61
US7218654B2May 15, 2007
Eye diagram improving method for laser transmitter
AVAGO TECH FIBER IP SG PTE LTD0 citations51
SAMSUNG ELECTRONICS CO LTD
2 patentsSAMSUNG ELECTRO MECH
2 patentsSHANJIN OPTOELECTRONICS SUZHOU CO LTD
2 patentsAVAGO TECHNOLOGIES GENERAL IP
1 patentAGILENT TECHNOLOGIES INC
1 patentKIM BEOMSUP
1 patentKIM JIN-HYUK
1 patentKCTECH CO LTD
1 patentLG DISPLAY CO LTD
1 patentLG CHEMICAL LTD
1 patentShowing the top 50 of 61 patents by PatentIndex Score.