Inventor
HOFFMEYER MARK KENNETH
US33 patents
⚠️ This page may combine multiple inventors who share the name “HOFFMEYER MARK KENNETH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS5757998AMay 26, 1998
Multigigabit adaptable transceiver module
IBM136 citations97
US6300578B1Oct 9, 2001
Pad-on-via assembly technique
IBM52 citations96
US6076726AJun 20, 2000
Pad-on-via assembly technique
IBM50 citations96
US5769989AJun 23, 1998
Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement
IBM76 citations95
US7658617B1Feb 9, 2010
Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer
IBM30 citations93
US7606033B2Oct 20, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM18 citations92
US7486516B2Feb 3, 2009
Mounting a heat sink in thermal contact with an electronic component
IBM32 citations92
US7435622B2Oct 14, 2008
High performance reworkable heatsink and packaging structure with solder release layer and method of making
IBM19 citations92
US7342306B2Mar 11, 2008
High performance reworkable heatsink and packaging structure with solder release layer
IBM22 citations92
US6497582B1Dec 24, 2002
LGA connector with integrated gasket
IBM36 citations92
US6134776AOct 24, 2000
Heatsink and package structure for wirebond chip rework and replacement
IBM44 citations92
US5789930AAug 4, 1998
Apparatus and method to test for known good die
IBM33 citations92
US5757073AMay 26, 1998
Heatsink and package structure for wirebond chip rework and replacement
IBM41 citations92
US7199309B2Apr 3, 2007
Structure for repairing or modifying surface connections on circuit boards
IBM19 citations91
US6912780B2Jul 5, 2005
Method and structure for repairing or modifying surface connections on circuit boards
IBM14 citations91
US6784377B2Aug 31, 2004
Method and structure for repairing or modifying surface connections on circuit boards
IBM25 citations91
US6024580AFeb 15, 2000
High performance pad on pad connector for flex circuit packaging
IBM33 citations91
US5873512AFeb 23, 1999
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
IBM42 citations90
US5806753ASep 15, 1998
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
IBM26 citations90
US7944698B2May 17, 2011
Mounting a heat sink in thermal contact with an electronic component
IBM9 citations84
US7173193B2Feb 6, 2007
Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board
IBM16 citations84
US7517230B2Apr 14, 2009
Customizable backer for achieving consistent loading and engagement of array package connections
IBM6 citations74
US7399185B2Jul 15, 2008
Customizable backer for achieving consistent loading and engagement of array package connections
IBM6 citations74
US6711026B2Mar 23, 2004
Sash for land grid arrays
IBM6 citations74
US6700068B2Mar 2, 2004
Adhesive-less cover on area array bonding site of circuit board
IBM11 citations70
US6499215B1Dec 31, 2002
Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
IBM10 citations70
US7079398B2Jul 18, 2006
Sash for land grid arrays
IBM5 citations63
US7197818B2Apr 3, 2007
Method and structures for implementing customizable dielectric printed circuit card traces
IBM2 citations58
US7129417B2Oct 31, 2006
Method and structures for implementing customizable dielectric printed circuit card traces
IBM5 citations58
BRODSKY WILLIAM LOUIS
2 patentsUS8179693B2May 15, 2012
Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements
BRODSKY WILLIAM LOUIS8 citations82
US8212156B2Jul 3, 2012
Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction
BRODSKY WILLIAM LOUIS3 citations60