Inventor
MAURER FREDERIC
US10 patents
Patents
10 patentsUS6527158B1Mar 4, 2003
Method and apparatus for forming solder bumps
IBM60 citations95
US6452117B2Sep 17, 2002
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
IBM76 citations95
US6056191AMay 2, 2000
Method and apparatus for forming solder bumps
IBM83 citations95
US6708873B2Mar 23, 2004
Apparatus and method for filling high aspect ratio via holes in electronic substrates
IBM21 citations92
US6461136B1Oct 8, 2002
Apparatus for filling high aspect ratio via holes in electronic substrates
IBM43 citations92
US6394334B1May 28, 2002
Method and apparatus for forming solder bumps
IBM24 citations92
US6319093B1Nov 20, 2001
Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement
IBM32 citations92
US6581280B2Jun 24, 2003
Method for filling high aspect ratio via holes in electronic substrates
IBM40 citations91
US6362557B1Mar 26, 2002
Ultrasonic method and actuator for inducing motion of an object
IBM17 citations84
US6579149B2Jun 17, 2003
Support and alignment device for enabling chemical mechanical polishing rinse and film measurements
IBM13 citations83