Inventor
CHIU TZ-CHENG
US15 patents
⚠️ This page may combine multiple inventors who share the name “CHIU TZ-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
13 patentsUS6784535B1Aug 31, 2004
Composite lid for land grid array (LGA) flip-chip package assembly
TEXAS INSTRUMENTS INC35 citations92
US6734567B2May 11, 2004
Flip-chip device strengthened by substrate metal ring
TEXAS INSTRUMENTS INC21 citations92
US7294451B2Nov 13, 2007
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
TEXAS INSTRUMENTS INC20 citations90
US7126217B2Oct 24, 2006
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
TEXAS INSTRUMENTS INC30 citations90
US6696644B1Feb 24, 2004
Polymer-embedded solder bumps for reliable plastic package attachment
TEXAS INSTRUMENTS INC25 citations90
US7572677B2Aug 11, 2009
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
TEXAS INSTRUMENTS INC14 citations81
US6861292B2Mar 1, 2005
Composite lid for land grid array (LGA) flip-chip package assembly
TEXAS INSTRUMENTS INC6 citations73
US6977429B2Dec 20, 2005
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
TEXAS INSTRUMENTS INC9 citations71
US7393719B2Jul 1, 2008
Increased stand-off height integrated circuit assemblies, systems, and methods
TEXAS INSTRUMENTS INC4 citations61
US7267861B2Sep 11, 2007
Solder joints for copper metallization having reduced interfacial voids
TEXAS INSTRUMENTS INC3 citations61
US7679190B2Mar 16, 2010
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
TEXAS INSTRUMENTS INC0 citations50
US6903000B2Jun 7, 2005
System for improving thermal stability of copper damascene structure
TEXAS INSTRUMENTS INC1 citations50
US7323362B2Jan 29, 2008
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
TEXAS INSTRUMENTS INC1 citations49