Inventor
KRIPESH VAIDYANATHAN
SG11 patents
⚠️ This page may combine multiple inventors who share the name “KRIPESH VAIDYANATHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AGENCY SCIENCE TECH & RES
5 patentsUS7230318B2Jun 12, 2007
RF and MMIC stackable micro-modules
AGENCY SCIENCE TECH & RES48 citations94
US6787456B1Sep 7, 2004
Wafer-level inter-connector formation method
AGENCY SCIENCE TECH & RES21 citations91
US7141487B2Nov 28, 2006
Method for ultra thinning bumped wafers for flip chip
AGENCY SCIENCE TECH & RES22 citations90
US7592703B2Sep 22, 2009
RF and MMIC stackable micro-modules
AGENCY SCIENCE TECH & RES2 citations61
US7189594B2Mar 13, 2007
Wafer level packages and methods of fabrication
AGENCY SCIENCE TECH & RES5 citations59
INST OF MICROELECTRONICS
2 patentsINFINEON TECHNOLOGIES AG
2 patentsUS6872464B2Mar 29, 2005
Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
INFINEON TECHNOLOGIES AG32 citations92
US6773956B2Aug 10, 2004
Method for contact-connecting a semiconductor component
INFINEON TECHNOLOGIES AG2 citations62