Inventor

GOODNER MICHAEL D

US50 patents

⚠️ This page may combine multiple inventors who share the name “GOODNER MICHAEL D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOODNER MICHAEL D

INTEL CORP

Stacked device underfill and a method of fabrication

Polymer sacrificial light absorbing structure and method

Forming polymer features on a substrate

Method of forming a selectively converted inter-layer dielectric using a porogen material

Low-temperature silicon nitride deposition

Method of forming air gaps in a dielectric material using a sacrificial film

Forming a porous dielectric layer

Using zeolites to improve the mechanical strength of low-k interlayer dielectrics

Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures

Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide

UV-activated dielectric layer

Composite sacrificial material

Forming a dielectric layer using porogens

Controlling resist profiles through substrate modification

Layered films formed by controlled phase segregation

Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures

Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide

Organic-framework zeolite interlayer dielectrics

Photosensitive dielectric layer

Composite sacrificial material

Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer

Polymer sacrificial light absorbing structure and method

Method to modulate etch rate in SLAM

Selectively growing a polymeric material on a semiconductor substrate

Plating a conductive material on a dielectric material

Plating a conductive material on a dielectric material

Precursors for film formation

Positive photosensitive resin composition, process for its preparation, and semiconductor devices

Sealing porous dielectric materials

Method to modulate etch rate in SLAM

Low-k dielectric layer formed from aluminosilicate precursors

Forming a silicon nitride film

Healing detrimental bonds in deposited materials

Stacked device underfill and a method of fabrication

Forming a dielectric layer using a hydrocarbon-containing precursor

Forming a porous dielectric layer

Forming chemical vapor depositable low dielectric constant layers

Sealing porous dielectric materials

Composite photoresist for modifying die-side bumps

UV-activated dielectric layer

Pixelated photoresists

Metal ion separation from aqueous solutions using photoswitchable ionophores

Energy harvesting molecules and photoresist technology

Silicon-doped carbon dielectrics

Photoactive resist capping layer

UNIV COLORADO

Method and material for use with dental composites for improving conversion of monomers to polymers and reducing volume shrinkage

LI BO

Antireflective coatings for via fill and photolithography applications and methods of preparation thereof

HONEYWELL INT INC

Antireflective coatings for via fill and photolithography applications and methods of preparation thereof

MEAGLEY ROBERT P

Forming semiconductor structures

GOODNER MICHAEL D

Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer