P

Inventor

TAKASHIMA AKIRA

JP109 patents
⚠️ This page may combine multiple inventors who share the name “TAKASHIMA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

21 patents
US6489676B2Dec 3, 2002

Semiconductor device having an interconnecting post formed on an interposer within a sealing resin

FUJITSU LTD289 citations99
US7049692B2May 23, 2006

Stacked semiconductor device

FUJITSU LTD166 citations98
US6621169B2Sep 16, 2003

Stacked semiconductor device and method of producing the same

FUJITSU LTD126 citations98
US5801439ASep 1, 1998

Semiconductor device and semiconductor device unit for a stack arrangement

FUJITSU LTD168 citations98
US6781241B2Aug 24, 2004

Semiconductor device and manufacturing method thereof

FUJITSU LTD100 citations97
US6388333B1May 14, 2002

Semiconductor device having protruding electrodes higher than a sealed portion

FUJITSU LTD285 citations97
US6812066B2Nov 2, 2004

Semiconductor device having an interconnecting post formed on an interposer within a sealing resin

FUJITSU LTD48 citations96
US6472746B2Oct 29, 2002

Semiconductor device having bonding wires serving as external connection terminals

FUJITSU LTD69 citations96
US6777799B2Aug 17, 2004

Stacked semiconductor device and method of producing the same

FUJITSU LTD89 citations95
US5760471AJun 2, 1998

Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package

FUJITSU LTD71 citations95
US6404062B1Jun 11, 2002

Semiconductor device and structure and method for mounting the same

FUJITSU LTD90 citations94
US5834831ANov 10, 1998

Semiconductor device with improved heat dissipation efficiency

FUJITSU LTD56 citations94
US6166433ADec 26, 2000

Resin molded semiconductor device and method of manufacturing semiconductor package

FUJITSU LTD59 citations93
US6972487B2Dec 6, 2005

Multi chip package structure having a plurality of semiconductor chips mounted in the same package

FUJITSU LTD36 citations92
US6960827B2Nov 1, 2005

Semiconductor device and manufacturing method thereof

FUJITSU LTD36 citations92
US6740970B2May 25, 2004

Semiconductor device with stack of semiconductor chips

FUJITSU LTD24 citations92
US6528348B2Mar 4, 2003

Semiconductor device having protruding electrodes higher than a sealed portion

FUJITSU LTD36 citations92
US5648681AJul 15, 1997

Semiconductor device having a supporting lead to support a bypass lead portion

FUJITSU LTD27 citations91
US6160313ADec 12, 2000

Semiconductor device having an insulating substrate

FUJITSU LTD24 citations90
US6457633B1Oct 1, 2002

Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls

FUJITSU LTD34 citations89
US5447888ASep 5, 1995

Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins

FUJITSU LTD17 citations74

TOSHIBA KK

8 patents

UNIV TEXAS

5 patents

MITSUBISHI ELECTRIC CORP

3 patents

KUBOTA LTD

3 patents

WEST ELECTRIC CO

2 patents

FUJITSU SEMICONDUCTOR LTD

1 patent

KUBOTA KK

1 patent

NANAO CORP

1 patent

MATSUSHITA DAISUKE

1 patent

INO TSUNEHIRO

1 patent

TAKASHIMA AKIRA

1 patent

YOSHIDA EIJI

1 patent

TDK CORP

1 patent

Showing the top 50 of 109 patents by PatentIndex Score.