Inventor
TAKASHIMA AKIRA
JP109 patents
⚠️ This page may combine multiple inventors who share the name “TAKASHIMA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
21 patentsUS6489676B2Dec 3, 2002
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
FUJITSU LTD289 citations99
US7049692B2May 23, 2006
Stacked semiconductor device
FUJITSU LTD166 citations98
US6621169B2Sep 16, 2003
Stacked semiconductor device and method of producing the same
FUJITSU LTD126 citations98
US5801439ASep 1, 1998
Semiconductor device and semiconductor device unit for a stack arrangement
FUJITSU LTD168 citations98
US6781241B2Aug 24, 2004
Semiconductor device and manufacturing method thereof
FUJITSU LTD100 citations97
US6388333B1May 14, 2002
Semiconductor device having protruding electrodes higher than a sealed portion
FUJITSU LTD285 citations97
US6812066B2Nov 2, 2004
Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
FUJITSU LTD48 citations96
US6472746B2Oct 29, 2002
Semiconductor device having bonding wires serving as external connection terminals
FUJITSU LTD69 citations96
US6777799B2Aug 17, 2004
Stacked semiconductor device and method of producing the same
FUJITSU LTD89 citations95
US5760471AJun 2, 1998
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
FUJITSU LTD71 citations95
US6404062B1Jun 11, 2002
Semiconductor device and structure and method for mounting the same
FUJITSU LTD90 citations94
US5834831ANov 10, 1998
Semiconductor device with improved heat dissipation efficiency
FUJITSU LTD56 citations94
US6166433ADec 26, 2000
Resin molded semiconductor device and method of manufacturing semiconductor package
FUJITSU LTD59 citations93
US6972487B2Dec 6, 2005
Multi chip package structure having a plurality of semiconductor chips mounted in the same package
FUJITSU LTD36 citations92
US6960827B2Nov 1, 2005
Semiconductor device and manufacturing method thereof
FUJITSU LTD36 citations92
US6740970B2May 25, 2004
Semiconductor device with stack of semiconductor chips
FUJITSU LTD24 citations92
US6528348B2Mar 4, 2003
Semiconductor device having protruding electrodes higher than a sealed portion
FUJITSU LTD36 citations92
US5648681AJul 15, 1997
Semiconductor device having a supporting lead to support a bypass lead portion
FUJITSU LTD27 citations91
US6160313ADec 12, 2000
Semiconductor device having an insulating substrate
FUJITSU LTD24 citations90
US6457633B1Oct 1, 2002
Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls
FUJITSU LTD34 citations89
US5447888ASep 5, 1995
Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins
FUJITSU LTD17 citations74
TOSHIBA KK
8 patentsUS8835896B2Sep 16, 2014
Nonvolatile variable resistance element
TOSHIBA KK7 citations84
US8355275B2Jan 15, 2013
Resistance change memory
TOSHIBA KK7 citations84
US8012315B2Sep 6, 2011
Lanthanoid aluminate film fabrication method
TOSHIBA KK7 citations84
US7902588B2Mar 8, 2011
Nonvolatile semiconductor memory device and method for manufacturing the same
TOSHIBA KK10 citations84
US7736446B2Jun 15, 2010
Method for manufacturing a lanthanum oxide compound
TOSHIBA KK8 citations84
US7518178B2Apr 14, 2009
Semiconductor memory device
TOSHIBA KK9 citations84
US7986016B2Jul 26, 2011
Semiconductor device and associated manufacturing methodology for decreasing thermal instability between an insulating layer and a substrate
TOSHIBA KK7 citations83
US7489006B2Feb 10, 2009
Nonvolatile semiconductor storage device and manufacturing method therefor
TOSHIBA KK6 citations74
UNIV TEXAS
5 patentsUS6046158AApr 4, 2000
Unique dendritic cell-associated C-type lectins, dectin-1 and dectin-2; compositions and uses thereof
UNIV TEXAS80 citations94
US7129039B2Oct 31, 2006
Unique dendritic cell-associated C-type lectins, dectin-1 and dectin-2; compositions and uses thereof
UNIV TEXAS15 citations91
US6852696B2Feb 8, 2005
Inhibitors of glycosaminoglycans
UNIV TEXAS18 citations90
US6653285B1Nov 25, 2003
Modulators of polysaccharides and uses thereof
UNIV TEXAS19 citations90
US6923965B2Aug 2, 2005
Modulators of polysaccharides and uses thereof
UNIV TEXAS15 citations82
MITSUBISHI ELECTRIC CORP
3 patentsKUBOTA LTD
3 patentsWEST ELECTRIC CO
2 patentsFUJITSU SEMICONDUCTOR LTD
1 patentKUBOTA KK
1 patentNANAO CORP
1 patentMATSUSHITA DAISUKE
1 patentINO TSUNEHIRO
1 patentTAKASHIMA AKIRA
1 patentYOSHIDA EIJI
1 patentTDK CORP
1 patentShowing the top 50 of 109 patents by PatentIndex Score.