Inventor

LIM SEUNG-WON

KR19 patents

⚠️ This page may combine multiple inventors who share the name “LIM SEUNG-WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIM SEUNG-WON

FAIRCHILD KR SEMICONDUCTOR LTD

Power module having stacked flip-chip and method of fabricating the power module

Stacked intelligent power module package

Power system module and method of fabricating the same

Power module and method of fabricating the same

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

High power semiconductor package

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Package and package assembly of power device

Power module for low thermal resistance and method of fabricating the same

Heat sink package

Power system module and method of fabricating the same

Power device packages and methods of fabricating the same

Power module for low thermal resistance and method of fabricating the same

High power semiconductor package and method of making the same

Leadless package

LEE KEUN-HYUK

Power device package and semiconductor package mold for fabricating the same

LIM SEUNG-WON

Power module having stacked flip-chip and method of fabricating the power module

YANG GWI-GYEON

Complex semiconductor packages and methods of fabricating the same

EOM JOO-YANG

Heat sink package