Inventor
CHOI SEUNG-YONG
KR18 patents
⚠️ This page may combine multiple inventors who share the name “CHOI SEUNG-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD KR SEMICONDUCTOR LTD
7 patentsUS7268414B2Sep 11, 2007
Semiconductor package having solder joint of improved reliability
FAIRCHILD KR SEMICONDUCTOR LTD53 citations96
US6574107B2Jun 3, 2003
Stacked intelligent power module package
FAIRCHILD KR SEMICONDUCTOR LTD99 citations95
US7492043B2Feb 17, 2009
Power module flip chip package
FAIRCHILD KR SEMICONDUCTOR LTD27 citations92
US7632719B2Dec 15, 2009
Wafer-level chip scale package and method for fabricating and using the same
FAIRCHILD KR SEMICONDUCTOR LTD21 citations91
US7936054B2May 3, 2011
Multi-chip package
FAIRCHILD KR SEMICONDUCTOR LTD22 citations89
US7786570B2Aug 31, 2010
Heat sink package
FAIRCHILD KR SEMICONDUCTOR LTD6 citations72
US7728437B2Jun 1, 2010
Semiconductor package form within an encapsulation
FAIRCHILD KR SEMICONDUCTOR LTD4 citations60
SAMSUNG ELECTRO MECH
4 patentsUS9706661B2Jul 11, 2017
Electronic device module and manufacturing method thereof
SAMSUNG ELECTRO MECH5 citations72
US9510461B2Nov 29, 2016
Electric component module and method of manufacturing the same
SAMSUNG ELECTRO MECH6 citations69
US9929116B2Mar 27, 2018
Electronic device module and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US9673123B2Jun 6, 2017
Electronic device module and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
FAIRCHILD SEMICONDUCTOR
3 patentsUS7154186B2Dec 26, 2006
Multi-flip chip on lead frame on over molded IC package and method of assembly
FAIRCHILD SEMICONDUCTOR42 citations92
US7335532B2Feb 26, 2008
Method of assembly for multi-flip chip on lead frame on overmolded IC package
FAIRCHILD SEMICONDUCTOR9 citations84
US7638861B2Dec 29, 2009
Flip chip MLP with conductive ink
FAIRCHILD SEMICONDUCTOR14 citations82