Inventor
MII TATSUNARI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “MII TATSUNARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
24 patentsUS7621436B2Nov 24, 2009
Wire bonding method
SHINKAWA KK128 citations97
US7044357B2May 16, 2006
Bump formation method and wire bonding method
SHINKAWA KK21 citations92
US6080651AJun 27, 2000
Wire bonding method
SHINKAWA KK22 citations92
US6041995AMar 28, 2000
Wire bonding method
SHINKAWA KK42 citations92
US6036080AMar 14, 2000
Wire bonding method
SHINKAWA KK20 citations92
US5906308AMay 25, 1999
Capillary for use in a wire bonding apparatus
SHINKAWA KK23 citations92
US5884830AMar 23, 1999
Capillary for a wire bonding apparatus
SHINKAWA KK24 citations92
US7821140B2Oct 26, 2010
Semiconductor device and wire bonding method
SHINKAWA KK16 citations84
US7025247B2Apr 11, 2006
Wire bonding method
SHINKAWA KK11 citations84
US7934634B2May 3, 2011
Wire bonding method
SHINKAWA KK8 citations83
US6173885B1Jan 16, 2001
Method for forming a ball in wire bonding
SHINKAWA KK7 citations74
US5259548ANov 9, 1993
Wire bonding method
SHINKAWA KK11 citations74
US6595400B2Jul 22, 2003
Wire bonding apparatus
SHINKAWA KK8 citations73
US6467678B2Oct 22, 2002
Wire bonding method and apparatus
SHINKAWA KK9 citations73
US5958259ASep 28, 1999
Method for forming a ball in wire bonding
SHINKAWA KK11 citations72
US7808116B2Oct 5, 2010
Semiconductor device and wire bonding method
SHINKAWA KK5 citations68
US6645346B2Nov 11, 2003
Workpiece holding device for a bonding apparatus
SHINKAWA KK6 citations62
US5524811AJun 11, 1996
Wire bonding method
SHINKAWA KK5 citations62
US7851347B2Dec 14, 2010
Wire bonding method and semiconductor device
SHINKAWA KK0 citations52
US7661576B2Feb 16, 2010
Wire bonding method
SHINKAWA KK0 citations52
US7617966B2Nov 17, 2009
Semiconductor device
SHINKAWA KK0 citations52
US7458498B2Dec 2, 2008
Semiconductor device and a wire bonding method
SHINKAWA KK0 citations52
US5261777ANov 16, 1993
Pushing device
SHINKAWA KK0 citations52
US7910472B2Mar 22, 2011
Method of manufacturing semiconductor device
SHINKAWA KK0 citations51
MII TATSUNARI
4 patentsUS8815732B2Aug 26, 2014
Wire bonding method and semiconductor device
MII TATSUNARI4 citations71
US8143155B2Mar 27, 2012
Wire bonding method and semiconductor device
MII TATSUNARI4 citations61
US8678266B2Mar 25, 2014
Wire bonding method
MII TATSUNARI1 citations50
US8232656B2Jul 31, 2012
Semiconductor device
MII TATSUNARI0 citations50