Inventor
TOYAMA TOSHIHIKO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “TOYAMA TOSHIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
9 patentsUS7621436B2Nov 24, 2009
Wire bonding method
SHINKAWA KK128 citations97
US6491202B1Dec 10, 2002
Wire bonding apparatus and method
SHINKAWA KK23 citations91
US7934634B2May 3, 2011
Wire bonding method
SHINKAWA KK8 citations83
US6467679B2Oct 22, 2002
Wire bonding method
SHINKAWA KK11 citations72
US12087725B2Sep 10, 2024
Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus
SHINKAWA KK2 citations71
US7808116B2Oct 5, 2010
Semiconductor device and wire bonding method
SHINKAWA KK5 citations68
US7910472B2Mar 22, 2011
Method of manufacturing semiconductor device
SHINKAWA KK0 citations51
US12374653B2Jul 29, 2025
Manufacturing method of semiconductor device and wire bonding apparatus
SHINKAWA KK0 citations50
US12191173B2Jan 7, 2025
Wire tension adjustment method and wire tension adjuster
SHINKAWA KK0 citations47