Inventor

TAKAHASHI HISAYA

JP19 patents

⚠️ This page may combine multiple inventors who share the name “TAKAHASHI HISAYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKAHASHI HISAYA

NEC CORP

Mounting substrate with a solder resist layer and method of forming the same

Connection structure of two-dimensional array optical element and optical circuit

Method for forming a Cu interconnect pattern

Method of making printed wiring boards

Optical interconnection device

KOREEDA YUICHI

Combination of optical connector inspection apparatus and optical connector capable of inspecting a held posture of an optical fiber

Optical connector

Photoelectric conversion/connection device

KATAGIYAMA NAOKI

Optical connector capable of assembling therein optical fiber led out from rear of ferrule and optical connector system containing same

Optical connector device and mating optical connector device

JAPAN AVIATION ELECTRON

Assembly-type durable optical connector adapter

Optical connector having an internal clearance at a part to be connected to an optical fiber

FUJI HEAVY IND LTD

Light-emitting apparatus

Light-emitting apparatus

NEC TOPPAN CIRCUIT SOLUTIONS

Printed circuit board and method for manufacturing same

LASERFRONT TECHNOLOGIES INC

Laser diode module, laser apparatus and laser processing apparatus

TOWA CORP LTD

Pair of working gloves

NEC CORPROATION

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

TAKAHASHI HISAYA

Light-emitting apparatus having a heat-resistant glass substrate separated through a vacuum layer from a glass substrate used as the light projection plane